Through the wonders of modern digital networking, I attended the annual ODVA press conference from Nuremberg without the expense of travel. They had two announcements. Perhaps I can make the annual meeting in Florida next March.

EtherNet/IP Concurrent Connections for Critical Applications now Available with CIP Safety

CIP Safety on EtherNet/IP technology has been enhanced to allow for the use of Concurrent Connections for applications requiring both high availability and functional safety. Concurrent Connections allow for communication redundancy between multiple producing and consuming devices for the most critical automation processes. CIP Safety provides fail-safe communication between nodes such as safety I/O blocks, safety interlock switches, safety light curtains and safety controllers in both machine and process automation safety applications up to Safety Integrity Level (SIL) 3 according to IEC 61508 standards. The use of Concurrent Connections with CIP Safety on EtherNet/IP allows for redundancy and functional safety to be integrated to ensure the best uptime and worker safety.

Concurrent Connections are CIP connections that support fault tolerance via redundant devices. Concurrent Connections enable many CIP connection paths, which allows data to be sent multiple times over multiple paths between the producing and consuming devices, independent of how the devices are physically interconnected. Originators, routers, and targets can all have multiple devices participating, and the Concurrent Connection and any of the duplicated device pairs can fulfill the role and the connection. This reduces time that would otherwise be needed to detect failures and eliminates the time that would have to be spent switching between paired devices. The redundant pair send and receive data continuously, so even if a failure is detected in one of the devices, the control process can continue uninterrupted.

CIP Safety mitigates common errors that can result in hazardous situations via various techniques as described in IEC 61784-3-2. Time stamps are used with time expectation to detect if packets are lost, delayed, repeated or transmitted out of order. Unique device identifiers are used to authenticate the communication between two safety devices. Additional diagnostics and checks are included to validate that the messages are not corrupted in transit and all these features are separate from standard communication methods.  When these mitigations are put together as CIP Safety, a single connection between two devices (wired or wireless) can be used for communications certified up to SIL 3 per IEC 61508 and up to Category 4/PLe per ISO 13849-1.

“The availability of Concurrent Connections for CIP Safety on EtherNet/IP creates a whole new level of assurance that industrial networks will be both resilient and safe in the face of device failure or communication errors,” according to Dr. Al Beydoun, President and Executive Director of ODVA. “Concurrent Connections for CIP Safety is a win-win that offers the highest availability and functional safety together to enable the toughest applications to be handled while reducing injuries and increasing output.”

CIP Safety and Concurrent Connections have been available separately to provide industrial network functional safety and redundancy in the case of device errors or failure. The purpose of Concurrent Connections for CIP Safety is to provide automation network designers with a way to leverage both the higher system availability advantages offered by standard Concurrent Connections while maintaining the safety integrity offered by CIP Safety connections. 

Process Device Profiles for EtherNet/IP Expanded to Include RTD and Thermocouple Temperature Sensors 

New process device profiles for temperature sensors are now available as a part of The EtherNet/IPTM Specification. Process device profiles help system integrators and end users to be able to efficiently commission new devices and to more easily replace devices for optimized plant operations. Process device profiles provide standardization for process variables and diagnostics for smoother vendor interoperability and easier controller data integration from EtherNet/IP network capable field devices. Device profiles are available for Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, and now Resistance Temperature Detector (RTD) and thermocouple temperature devices. The value of the standard formatting of process variables, data totals, and diagnostics that process device profiles provide is further enhanced with the new addition of temperature profiles.

The introduction of process device profiles for temperature, in addition to flow and pressure, supports more seamless integration for end users through a greater ecosystem of EtherNet/IP device interchangeability. The temperature device profile contains one instance of the process measurement value object to provide a temperature value and status.  The device profile also contains several process device diagnostics instances to provide diagnostic information. Temperature devices measure relative heat or cold using a thermocouple or RTD device. Thermocouples rely on two dissimilar metals joined at one end producing a voltage difference between the two materials to measure temperature. The voltage is directly proportional to the temperature difference between the two ends. RTDs operate based on the principle that the electrical resistance of a metal increases with temperature. RTDs tend to provide greater accuracy while thermocouples can offer a greater temperature sensing range.

“The addition of a new temperature process device profiles for EtherNet/IP provides end users with another valuable tool to enable more efficient device commissioning and replacement,” said Dr. Al Beydoun, President and Executive Director of ODVA. “All EtherNet/IP process device profiles are aligned with the Process Automation Device Information Model (PA-DIM) and NAMUR NE 107 diagnostics. This allows for easier movement of data from the factory floor to the cloud for analysis and action and quicker identification of maintenance issues through standardization.”

EtherNet/IP process device profiles allow for improved vendor interoperability through standardized access to process variables and critical diagnostics such as NAMUR NE 107 status signals as well as more seamless integration with PA-DIM. The addition of temperature devices to EtherNet/IP process device profiles enlarges the ecosystem available devices that offer simpler commissioning and enhanced asset monitoring and integration into higher level PLC, DCS, and cloud-based systems. ODVA is continuing to adapt EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles. Visit odva.org to obtain the latest version of The EtherNet/IP Specification including temperature process devices profiles for EtherNet/IP.

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