Advanced Physical Layer (APL) for Ethernet generated much hype for quite some time. Product may be coming your way before too long.

After almost 4 years of close and fruitful collaboration among the four leading standards development organizations, FieldComm Group, ODVA, OPC Foundation, and PROFIBUS & PROFINET International (PI), combined with significant support from 12 major industry project partners, the participants are pleased to announce a successful completion of the APL Project. The result is a completely available 10Mbit technology for a new two-wire, Intrinsically Safe Physical Layer called Ethernet-APL.

The main results of the APL Project are port profile specifications to create the Ethernet-APL solution for multiple power levels with and without explosion hazardous area protection, engineering guidelines and best practices for planning and installation, and conformance test specifications and test tools. As a single physical layer, Ethernet-APL supports EtherNet/IP, HART-IP, OPC UA, PROFINET, or any other higher-level network protocol.

The APL Project has also worked with semiconductor manufacturers to bring 10BASE-T1L Phy chipsets for Ethernet-APL to market. 

BASF and Procter & Gamble have demonstrated that Ethernet-APL has very good suitability for use in process applications through their internal testing.

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