by Gary Mintchell | Dec 6, 2024 | Automation, Enterprise IT, Industrial Computers
I think this is the last of the meetings I had at Automation Fair last month. The team at Stratus discussed the ztC Endurance platform. Stratus is know for high availability, redundant server and compute technology. This new platform enables organizations to run critical applications without downtime or data loss, in edge or data center environments, using intelligent, predictive fault tolerance based on Stratus’ redundant hardware architecture, hardened drivers, and Stratus Automated Uptime Layer with Smart Exchange.
Both OT and IT teams face the challenge of delivering reliability to both centralized and distributed locations across their operations. They also may lack on-site technical staff needed to maintain complex infrastructure. Platforms running critical applications must be easy to deploy, easy to manage, and easy to service—and not just in data centers, but at the edge of corporate networks.
Stratus ztC Endurance provides continuous availability and ensures data integrity for mission-critical applications running at the edge, operations center, and data center. Delivering seven nines (99.99999%) uptime, its Automated Uptime Layer with Smart Exchange provides continual proactive health monitoring and automatically takes action to maintain system availability and protect against data loss when needed. Coupled with the platform’s modular design of hot-swappable customer replacement units (CRUs), ztC Endurance makes it easy for OT and IT teams to manage and support. ztC Endurance delivers the processing power and performance to host dozens of software applications as virtual machines (VMs), dramatically reducing the number of PCs or servers required for OT and IT teams to manage and maintain.
Key Benefits
- Seven nines availability for critical applications: Built-in computing fault tolerance delivers 99.99999% availability to run critical applications.
- No loss of data: Redundant computing architecture combined with intelligent automated management prevents in-flight data loss and ensures data integrity.
- “Zero touch” management and support: Modular design plus pro-active remote health monitoring and self-healing simplifies system management and serviceability for both IT and OT teams.
- Rapid modernization and workload consolidation: Modernize infrastructure and streamline operations by leveraging virtualization to consolidate multiple software workloads onto a single platform.
- Multi-layered security: Supports multi-layered defense-in-depth approaches, with focus on both process and product security guidelines to ensure maximum protection.
- Lower TCO: Reduce IT footprint and purchase fewer software licenses on a highly reliable platform with an expected 7-10 year lifespan, twice that of traditional servers.
by Gary Mintchell | Dec 4, 2024 | Automation, News, Organizations, Software
A marketing person offered a meeting with Sanu Warrier, Software Product Director at nVent during the recent Automation Fair. I have not kept up with all mergers and acquisitions. NVent is the parent company of Hoffman enclosures and much more.
My last update from this company was several years ago. I was familiar with electrical enclosure layout CAD software. A customer actually bought one from me in the 90s. But why would there be a director of software and a meeting?
This software has progressed from my time. It provides digital twin technology. Manufacturers, machine builders, and OEMs find this helpful. The software provides information for wire routing, hydraulics and pneumatics information, schematics, panel layout for hole drilling, components library. They incorporate one of my favorite applications included is workflow for building the panel, provides information for cutting and putting connectors of each wire, then information for which wire to assemble next and where to connect it. And, of course, work instructions.
The application is called Assembly Task Manager, Connected Assembly.
Very interesting.
by Gary Mintchell | Nov 27, 2024 | Automation, Networking
I remember Digi from many years ago as a networking interface of serial to Ethernet. I lost track of the company for some years. It has become active over the past few years, still working on connectivity. This news concerns further connectivity options.
Digi International’s Digi Connect Sensor XRT-M, powered by Digi Axess, has been officially certified for use on the T-Mobile network.
This certification enables provision of reliable and enhanced remote monitoring solutions to T-Mobile customers. The recently launched Digi Connect Sensor XRT-M is tailored for businesses operating in precision agriculture, municipal water utilities, mining, and industrial gas and chemical verticals. It offers cloud-based control, ensuring optimal performance and seamless connectivity for remote monitoring applications. Additionally, Digi Connect Sensor XRT-M is enhanced by seamless integration with the Digi Axess management platform.
by Gary Mintchell | Nov 26, 2024 | Automation, Events, News
Blake Moret deserves credit for many reasons during his tenure as CEO of Rockwell Automation. He has not been afraid to try things. If they don’t work out, he just pivots and tries something else.
There was the interlude with PTC and ThingWorx. Rockwell gained some benefit, but in the end the benefits were less than spectacular. He sold the stake and acquired Plex (operations software) and Fiix (maintenance management software) gaining solid cloud-based performers.
He also brought in a diverse lineup of senior management including some from outside the company. Outsiders usually leave after a few years, and indeed, the senior level executive cadre consists primarily of people who came up through the ranks. This is not a criticism. Sort of just the way it is. But it helps bringing in fresh thinking. Senior management is also not limited to old white men. There is diversity at the top levels which should make for more interesting discussions.
These comments introduce the 2024 edition of Automation Fair. The format introduced last year makes the experience more like the previous TechEd events with a helping of the in-house trade show that was Automation Fair. All attendees pay a fee to get in. Distributors previously brought customers who had free admittance to the show. That was one reason for the high attendance numbers.
People wondered how it would work this year. It worked. Well, 11,000 people showed up. The show floor and technical sessions were packed. I’d say it was successful.
Moret’s key message during his talks can be summarized as simplification. He stated he was proud of the way the development teams have made things work together better. Rockwell has enhanced the edge-to-cloud experience. “Autonomous,” meaning AI and AMRs, add to existing workflows while lowering the risk of implementation. This topic also includes software-defined architecture and extensive use of digital twin. He finished mentioning Rockwell’s extensive consulting group which houses much domain expertise.
I have more notes than will fit even a long-form blog post. The following compilation takes you through a couple of days of keynotes and briefings.
Matheus Bulho, SVP of Software and Control, spoke on the machine layer. The Design software layer integrates devops into the design platform. It continuously updates the code base in the cloud during development meaning developers can easily visualize code conflict from different programmers.
Logix Echo and Emulate3D finally realize a vision I wrote about from Rockwell Automation perhaps 20 years ago. The technology has arrived to enable design and commission of an entire system in virtual space in partnership with Nvidia. Rockwell has also integrated Copilot into the platform. Software-defined automation has arrived at the platform, as well.
Tessa Myers, SVP Intelligent Devices discussed products targeted at line and plant layers. “We’re driving end-to-end performance with smart, connected machines. End-to-end orchestration includes production logistics, operations management software, material handling, production logistics, and consulting expertise reimagine how material moves through manufacturing lines.
Products include Plex software, OTTO AMR technology, data-ready equipment, Mosaics, industrial data ops, and EnergyManager.
Matt Fordenwalt, SVP Lifecycle Services, handled the Enterprise level of products during the Tuesday keynotes. He discussed security and data standards pointing to Fortinet system level thinking combined with OT and IT domain expertise. Adding Claroty software for visibility and intelligence plus RA company Verve. Other partners in the security chain include Dragos, Crowd Strike, Microsoft, and Cisco.
Some notes from a series of press briefings:
Emmanuel Guilhamon, Vice President, Sustainability, discussed how AI will be helping companies meet environmental goals. He emphasized the need to build business cases in order to sell sustainability to management.
Jordan Reynolds, Vice President of AI, (yes, RA has a VP of AI) told us AI should not be thought of as a separate product. Rather, AI is being built into many products to make them easier and simpler to use, as well as, more powerful.
Matt Rendell, Chief Executive Officer, Clearpath Robotics by Rockwell Automation and Ryan Gariepy, Chief Technology Officer, OTTO Motors by Rockwell Automation reported on advanced robotics and OTTO motors bringing connected factories to life. These recently acquired companies can now better integrate out of the box due to joining RA. These form an integral part of RA’s connected factory vision.
Tony Carrara, Business Manager, FactoryTalk Design Studio,
FactoryTalk DesignStudio, still targeted for discrete, introducing motion and process 18 months or so, Copilot, modernizing building automation system, hosting in Azure, project creation, product guidance, project guidance GenAI use cases; Copilot January 2025, also first release cloud to controller; Innovation Booth; (hmm, no AR/VR); testing guardrails for LLMs in Logix, future research voice interaction;
Michael Bayer, Director of Contracts Capabilities, and Rick Kaun, Vice President of Solutions, Verve Industrial, a Rockwell Automation Company brought Cybersecurity into focus as a business risk. From sensors to controllers, it’s all about data. And that is a risk. People in the factory are not cybersecurity experts, so help is needed. Insurance companies are pressuring the Board to meet the risk. Employees are asking for skills. They want to be security savvy. Kaun says the Verve platform helps clients find assets.
Kris Dornan, Commercial Marketing Manager, and Liz Bahl Prosak, Commercial Portfolio Manager, presented the LogixSIS (safety integrated system for process safety).
Key Capabilities of Logix SIS:
- Modern SIL 2 and SIL 3 solutions delivers comprehensive safety across a wide range of industrial applications.
- High availability safety delivers continuous operation for critical processes.
- Streamline implementation by leveraging familiar hardware and software.
- Reduce engineering time to maximize efficiency through simplified design and configuration.
- Upgrade the system without requiring planned downtime.
- Available through Rockwell Automation distribution channels that provide convenient access to customers worldwide.
Show Floor Tours
One item from the show floor tour piqued my interest—VisionAI. Touted as Rockwell Automation’s first vision system, it features AI-driven software with strong data capabilities and expected connectivity. Actually, this is the third RA vision system. I sold and installed a few in the mid-1990s. It was called the CVIM. A product called VIM preceded that one. The CVIM was powerful, had a huge footprint, and was prohibitively expensive by 1996. I became an editor in 1998 and witnessed the demise of the product.
It’s expensive for me to go to Automation Fair. I weigh the costs carefully. Information was abundant. Meeting old colleagues invigorates the week for one who works alone. I’m glad I made this trip. Next year in Chicago is a no-brainer.
by Gary Mintchell | Nov 25, 2024 | Automation, Networking, News, Organizations
Through the wonders of modern digital networking, I attended the annual ODVA press conference from Nuremberg without the expense of travel. They had two announcements. Perhaps I can make the annual meeting in Florida next March.
EtherNet/IP Concurrent Connections for Critical Applications now Available with CIP Safety
CIP Safety on EtherNet/IP technology has been enhanced to allow for the use of Concurrent Connections for applications requiring both high availability and functional safety. Concurrent Connections allow for communication redundancy between multiple producing and consuming devices for the most critical automation processes. CIP Safety provides fail-safe communication between nodes such as safety I/O blocks, safety interlock switches, safety light curtains and safety controllers in both machine and process automation safety applications up to Safety Integrity Level (SIL) 3 according to IEC 61508 standards. The use of Concurrent Connections with CIP Safety on EtherNet/IP allows for redundancy and functional safety to be integrated to ensure the best uptime and worker safety.
Concurrent Connections are CIP connections that support fault tolerance via redundant devices. Concurrent Connections enable many CIP connection paths, which allows data to be sent multiple times over multiple paths between the producing and consuming devices, independent of how the devices are physically interconnected. Originators, routers, and targets can all have multiple devices participating, and the Concurrent Connection and any of the duplicated device pairs can fulfill the role and the connection. This reduces time that would otherwise be needed to detect failures and eliminates the time that would have to be spent switching between paired devices. The redundant pair send and receive data continuously, so even if a failure is detected in one of the devices, the control process can continue uninterrupted.
CIP Safety mitigates common errors that can result in hazardous situations via various techniques as described in IEC 61784-3-2. Time stamps are used with time expectation to detect if packets are lost, delayed, repeated or transmitted out of order. Unique device identifiers are used to authenticate the communication between two safety devices. Additional diagnostics and checks are included to validate that the messages are not corrupted in transit and all these features are separate from standard communication methods. When these mitigations are put together as CIP Safety, a single connection between two devices (wired or wireless) can be used for communications certified up to SIL 3 per IEC 61508 and up to Category 4/PLe per ISO 13849-1.
“The availability of Concurrent Connections for CIP Safety on EtherNet/IP creates a whole new level of assurance that industrial networks will be both resilient and safe in the face of device failure or communication errors,” according to Dr. Al Beydoun, President and Executive Director of ODVA. “Concurrent Connections for CIP Safety is a win-win that offers the highest availability and functional safety together to enable the toughest applications to be handled while reducing injuries and increasing output.”
CIP Safety and Concurrent Connections have been available separately to provide industrial network functional safety and redundancy in the case of device errors or failure. The purpose of Concurrent Connections for CIP Safety is to provide automation network designers with a way to leverage both the higher system availability advantages offered by standard Concurrent Connections while maintaining the safety integrity offered by CIP Safety connections.
Process Device Profiles for EtherNet/IP Expanded to Include RTD and Thermocouple Temperature Sensors
New process device profiles for temperature sensors are now available as a part of The EtherNet/IPTM Specification. Process device profiles help system integrators and end users to be able to efficiently commission new devices and to more easily replace devices for optimized plant operations. Process device profiles provide standardization for process variables and diagnostics for smoother vendor interoperability and easier controller data integration from EtherNet/IP network capable field devices. Device profiles are available for Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, and now Resistance Temperature Detector (RTD) and thermocouple temperature devices. The value of the standard formatting of process variables, data totals, and diagnostics that process device profiles provide is further enhanced with the new addition of temperature profiles.
The introduction of process device profiles for temperature, in addition to flow and pressure, supports more seamless integration for end users through a greater ecosystem of EtherNet/IP device interchangeability. The temperature device profile contains one instance of the process measurement value object to provide a temperature value and status. The device profile also contains several process device diagnostics instances to provide diagnostic information. Temperature devices measure relative heat or cold using a thermocouple or RTD device. Thermocouples rely on two dissimilar metals joined at one end producing a voltage difference between the two materials to measure temperature. The voltage is directly proportional to the temperature difference between the two ends. RTDs operate based on the principle that the electrical resistance of a metal increases with temperature. RTDs tend to provide greater accuracy while thermocouples can offer a greater temperature sensing range.
“The addition of a new temperature process device profiles for EtherNet/IP provides end users with another valuable tool to enable more efficient device commissioning and replacement,” said Dr. Al Beydoun, President and Executive Director of ODVA. “All EtherNet/IP process device profiles are aligned with the Process Automation Device Information Model (PA-DIM) and NAMUR NE 107 diagnostics. This allows for easier movement of data from the factory floor to the cloud for analysis and action and quicker identification of maintenance issues through standardization.”
EtherNet/IP process device profiles allow for improved vendor interoperability through standardized access to process variables and critical diagnostics such as NAMUR NE 107 status signals as well as more seamless integration with PA-DIM. The addition of temperature devices to EtherNet/IP process device profiles enlarges the ecosystem available devices that offer simpler commissioning and enhanced asset monitoring and integration into higher level PLC, DCS, and cloud-based systems. ODVA is continuing to adapt EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles. Visit odva.org to obtain the latest version of The EtherNet/IP Specification including temperature process devices profiles for EtherNet/IP.
by Gary Mintchell | Nov 21, 2024 | Automation, Industrial Computers, Technology
Other World Computing’s products are not often directly automation related. You may find many uses outside of control and HMI applications. They also show where some breakthrough computing resources are heading. These news items relate to Thunderbolt 5 ports and storage for high resolution photography.
Other World Computing (OWC), a leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, announced the general availability launch of the OWC Thunderbolt 5 Hub – opening a new world of workflow possibilities and performance.
By turning a single cable connection into three ThunderboltTM 5 ports and one USB-A port, the new OWC Thunderbolt 5 Hub breaks the connectivity handcuffs of host machines not offering enough Thunderbolt 5 ports. With up to 80Gb/s of bi-directional data speed – up to 2x faster than Thunderbolt 4 and USB4 – and up to 120Gb/s for higher display bandwidth needs, the OWC Thunderbolt 5 Hub redefines productivity. Connect portable SSDs exceeding 6000MB/s*, up to three 8K displays @60Hz with DSC, today’s USB-C connector compatible devices, and yesterday’s USB-A desktop accessories – all while keeping modern notebooks and tablets powered and charged up for mobile use with 140 watts.
Key Features of the OWC Thunderbolt 5 Hub:
- Easy Port Expansion – Adds more universally compatible Thunderbolt 5 (USB-C) ports to a Mac, PC,iPad Pro, or tablet to greatly expand device connectivity possibilities and productivity
- Incomparable Speed – Work and play faster with up to 80Gb/s of bi-directional data speed and up to 120Gb/s for higher display bandwidth needs
- Works with Millions – No worries or confusion…connect to Thunderbolt 4, Thunderbolt 3, USB-C, or USB4 machine or device with 100% compatibility**
- Best Today, Best Tomorrow – Delivers the best performance of devices with today’s computers and best speed possible in the future with a Thunderbolt 5 Mac or PC
- Multiple Daisy Chains – Create three separate daisy chains of devices – even bus-powered – and remove devices from one chain without affecting the other chains
- Powerful – Safely delivers up to 140 watts to charge the most power-hungry notebook computer
- Stunning Visuals – Connect to the latest and future Thunderbolt, USB-C, and DisplayPort displays for incredible 4K, 5K, 6K, and up to three 8K displays***
- Thunderbolt Certified – Built-in OWC reliability and dependability for Mac and Windows
- Silently Cool – Fanless aluminum enclosure for quiet and cool operation
For further information and specs or to place an order.
Other World Computing (OWC), a leader in delivering high-performance, secure, and sustainable technology solutions that enhance and extend the life of Macs and PCs, announced the general availability launch of the latest addition to its OWC Atlas Pro family of memory cards – the 240GB OWC Atlas Pro CFexpress 4.0 Type A Card. Based on popular demand, this new capacity option combines the fast speeds users expect from OWC with a more accessible price point, making it the ideal choice for Sony users who require professional-grade performance without the need for maximum capacity.
OWC CFexpress 4.0 Type A Atlas Pro cards are perfect for pro filmmakers and extreme action photographers who want to dramatically speed up their offloads while retaining full compatibility with existing devices. Users experience double the speeds of CFexpress 2.0 cards with 1850MB/s read speeds through OWC Atlas USB4 CFexpress 4.0 card reader while providing 1700MB/s write speed for current and future cameras that can take advantage of such performances. OWC’s Atlas CFexpress 4.0 Type A cards are VPG200 certified, ensuring they work seamlessly with all existing Sony camera modes. Like the 480GB to 960GB cards, the new 240GB capacity cards are:
- Lightning Fast – Up to 1700MB/s write and 1850MB/s read speeds for the most advanced use cases of professional content creators, including fast burst RAW image sequences and high bitrate video recording up to 8K
- Dependable – Delivers 400MB/s minimum sustained write speed
- Compatible – Designed for use in Sony Alpha and FX cameras, including a9 III, a1, a7SIII, a7IV, a7rV, FX3, FX6, FR7, and FX30, as well as CFexpress Type A memory card readers and reader slot-equipped devices
- Supportive – VPG200 certified to work with all Sony camera modes and enable the highest allowable settings in Sony Alpha, FX, and FR7 cameras
- Compliant – Fully compliant with CFexpress Type A 4.0 specification and meets Type A 2.0 specifications
- Versatile – Includes Type A to Type B adapter to obtain maximum speed when paired with an OWC Atlas USB4 CFexpress 4.0 Card Reader
- Tough – Impact, bend, shock, ESD, UV ray, and X-ray resistant
The 240GB capacity Atlas CFexpress Type A cards are now generally available for $199.99.
