by Gary Mintchell | Apr 1, 2025 | Networking, Technology
Some final thoughts from the ODVA meetings in March in Florida. I’ve been thinking for some time about complexity. Sometimes we get into the weeds with our technologies, building routine atop routines, solving a multitude of problems through creating others.
The thinking began with considering my reporting from the March 2022 ODVA meetings.
Paul Maurath, Technical Director—Process Automation from Procter & Gamble’s Central Engineering, presented the user’s view of automation. I will dispense with suspense. His conclusion, ”Help us manage complexity.”
Maurath told the story of setting up a test process cell in the lab. They used it to test and demonstrate Ethernet APL devices and the network. They discovered that APL worked, the controller didn’t see any issues. The discouraging discovery was the amount of configuration required and the complexity of setup. He referred to an E&I technician working the shift on a Sunday morning at 3 am. Call comes in. Device is down. With a regular HART / 4-20 mA device, the tech has the tools. But with an Ethernet device configuration can be a problem.
Conclusion:
- There is a need for new technology to deliver functionality and simplicity
- Standards are great
- Please keep end users in mind when developing standards and technology
A paper presented this year by Paul Brooks, Rockwell Automation, Wolfgang Hoeferlin, Endress+Hauser, Sean Vincent, FieldComm Group, and Joakim Wiberg, ODVA discussed the complexities and difficulties following the acquisition of FDT technology by FieldComm Group (FCG). They noted the industrial automation community has the opportunity to enhance our technologies to allow a single device integration standard to be used through discrete, hybrid and process automation disciplines. Double work on business logic and user interface for a device across different technologies and for use in different applications can be eliminated.
In this paper we outline the use cases that FCG – together with ODVA, PNO and OPC Foundation – wish to address. We will look at some of the initial technical assumptions that allow this work to dovetail into device description improvements already underway within ODVA. We will discuss the framework that will allow ODVA members to contribute to and benefit from this work.
Disclaimer: I have not written a line of code in years. As they discussed the details of configuring and programming and data amongst all these technologies, I was impressed by the complexity and the difficulty of the work.
Another end user paper was presented by former GM engineer Gary Workman laying out reasons for some specification changes to define a control network in EtherNet/IP. Similar to the talk by Maurath above, he began with a discussion of the complexity of installing and implementing not individual EtherNet/IP devices instead looking at the network as a whole. He pointed to the problems of electricians and maintenance workers working with a network. His ask was whether ODVA could consider adding guidance for implementing an entire EtherNet/IP control network to help workers on the factory floor.
Most of these meetings discuss the basic technologies and extensions of the product. Whether agreeable or not, the point of view of the end user always serves as a call to step back and consider the problem from their point of view. (Maybe a third of my career was product development—considering the user’s need while developing a product. I sympathize.)
Back to Maurath—complexity is a friction point to the application of technology. It should be the task of the technology provider to remove as much friction as possible.
by Gary Mintchell | Mar 31, 2025 | Networking, Security
More news from ODVA at Hannover. Following a presentation by a cyber security researcher at the annual meeting, everyone agreed that implementing CIP Security was a must have.
ODVA announced that a new pull model for configuration data is now available for CIP Security, the cybersecurity network extension for EtherNet/IP. This new profile is in addition to the existing pull model for CIP Security certificates which allows for efficient distribution of device authenticity information.
The CIP Security pull model for configuration information will allow for parameters in JSON format to be automatically available for EtherNet/IP network-capable devices. This new configuration data will make it possible for non-CIP devices, such as mobile phones and tablets, to access secure EtherNet/IP information and for hierarchical metadata to be more readily available. CIP Security now includes a pull model for configuration data and device certificates along with security properties, including a broad trust domain across a group of devices, a narrow trust domain by user and role, data confidentiality, device and user authentication, device and user identity, and device integrity.
The CIP Security pull model for configuration defines a file encoded format for delivering CIP Security configuration as well as a mechanism for a device to pull or query this configuration. The pull model for configuration is valuable when the traditional CIP object/server/attribute mechanism of delivering the CIP Security configuration is not appropriate. Use cases for the new CIP Security pull model for configuration include software that does not have CIP target functionality, such as with a mobile device application and with devices that are on a private network with Network Address Translation (NAT) that has configuration software on the public network. Additionally, the pull model for configuration can help improve device replacement by being able to automatically provide the needed communication configuration on top of automatically pulling the certificate. The CIP Security pull model for configuration can be delivered via a JSON file, which provides the advantage over the CIP object/service method of decoupling the configuration from the transport. The CIP configuration information structure is still retained when using a JSON format. The JSON file also includes a digital signature that allows for authenticity of the data, independent of the transport over which it is delivered.
“The addition of a CIP Security pull model for configuration makes it easier to replace devices to minimize downtime and allows for configuration data to be automatically provided to mobile devices and devices on a private network,” said Dr. Al Beydoun, President and Executive Director of ODVA. “CIP Security development is a continuous effort to help deter bad actors from accessing EtherNet/IP networks that enable efficient production in critical industries across the world.”
The importance of cybersecurity continues to grow as more devices than ever before are being connected by users to the network via wireless and Single Pair Ethernet (SPE) technologies. Additionally, the connection of the device level network to ERP and cloud systems to take advantage of the latest Artificial Intelligence (AI) analytics to optimize operations means that a defense in depth approach that includes device level security is imperative. CIP Security already takes advantage of robust, proven, and open security technologies, including TLS and DTLS for secure transport, hashes or HMAC as a cryptographic method of providing data integrity and message authentication, X.509v3 digital certificates, OAuth 2.0, and, OpenID Connect for authentication, and encryption to prevent reading or viewing of EtherNet/IP data by unauthorized parties. CIP Security now includes a pull model for configuration data to enable mobile device and private network connectivity along with improved device replacement. CIP Security is a robust device level security protection for EtherNet/IP that can help vendors and end users to prepare for regulations such as the European Union Cyber Resilience Act (CRA) and to achieve compliance with security standards such as IEC 62443. Visit odva.org to obtain the latest version of The EtherNet/IP Specification including CIP Security.
by Gary Mintchell | Mar 31, 2025 | Networking, News, Organizations, Process Control
The first news from Hannover this morning concerns additions to EtherNet/IP device profiles. Delegates discussed continued updates for process devices at the annual meeting a couple of weeks ago.
ODVA announced that level sensors are the latest option for process device profiles to be added to The EtherNet/IP Specification. Process device profiles help users to reduce complexity and to more quickly install new devices in the event of an unplanned replacement. Standardized semantics and scaling for process variables and diagnostics that are made possible by process device profiles for EtherNet/IP significantly improve vendor interoperability and prepare process data for use with edge and cloud analytics. Device profiles are now available for level measurement along with Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, Resistance Temperature Detector (RTD) and thermocouple temperature sensors. Standardized data including process variables, diagnostics, and totals enable easier access to critical data to help optimize operations. The addition of level sensors to the suite of process device profiles further increases the value of the EtherNet/IP ecosystem.
The goal of process device profiles is to enable a device replacement experience that is as seamless as possible. Plug and play type capabilities for process field devices reduce the need for maintenance workers to be electronic device or Ethernet experts, and they make it possible to increase the efficiency of planned turnarounds while lowering the amount of unplanned downtime. The EtherNet/IP process device profile for level transmitters can be applied to devices that rely on free wave, guided wave, capacitive, magnetostrictive, radiometry, and buoyancy measuring technologies. Additionally, NAMUR NE 107 diagnostics are available for level transmitters that use free wave, guided wave, and radiometry sensor technology approaches. The introduction of level measurement process device profiles, in addition to temperature, flow and pressure, supports end users in being able to integrate EtherNet/IP capable devices in critical environments, to replace sensors regardless of vendor, and to support a harmonized data structure.
“The addition of level sensor support to the suite of EtherNet/IP process device profiles further promotes device interchangeability between vendors and supports easier integration with additional device types,” said Dr. Al Beydoun, President and Executive Director of ODVA. “New level measurement process device profiles for EtherNet/IP network-capable level sensors support NE 107 diagnostics and are aligned with the Process Automation – Device Information Model (PA-DIM). Process device profiles for EtherNet/IP reduce the commissioning and maintenance burden of adopting Ethernet-capable devices and provide a standardized information model foundation to enable usage of advanced edge and cloud analytics approaches, including AI.”
Standardized access to process variables with semantics and scaling that align with PA-DIM and critical diagnostics such as NAMUR NE 107 status signals are the foundation to the future of advanced analytics and optimization within process automation. Process device profiles for EtherNet/IP provide valuable standardization and a growing ecosystem of supported sensors to allow for quicker device installation and replacement, improved asset status, and easier integration into higher level data management systems. ODVA continues to invest in adapting EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles.
Obtain the latest version of The EtherNet/IP Specification including level measurement process devices profiles for EtherNet/IP.
by Gary Mintchell | Mar 25, 2025 | Internet of Things, Networking
5G and private 5G cellular networks were all the rage a few years ago. They hype cycle has progressed. I’ve seen some examples of real-world applications. It remains more promise than use at this time.
However, some news continues to flow through my system. This one is a partnership of sorts between Alcatel-Lucent Enterprise (ALE) and Celona. This new turnkey solution integrates with ALE’s OmniVista, OmniSwitch, and OmniAccess Stellar networking portfolio, enabling secure and high quality connectivity across complex enterprise environments including large outdoor spaces.
The cutting-edge technology in ALE’s Private 5G solution is engineered for ultra-reliable connectivity in complex industrial settings such as manufacturing, refineries, logistics warehouses, and ports including airport apron/ramp areas. The Private 5G solution offers large-area wireless coverage, secure and reliable high-speed mobility, supporting real-time, critical industrial applications, leading to enhanced IoT and Industry 4.0 integration.
This technology enables connecting next-generation IoT devices and applications that demand ultra-low latency and deterministic performance in enterprises pioneering the use of state-of-the-art devices and technologies, including autonomous guided vehicles (AGVs), robotics, HD video analytics, augmented reality (AR), and virtual reality (VR) applications, all of which will benefit from robust wireless connectivity.
ALE is integrating Private 5G with its existing solutions, such as OmniVista Cirrus, OmniSwitch LAN, and OmniAccess Stellar WLAN, to deliver reliable augmented coverage across industrial sites, offices and campuses. This approach ensures end-to-end secure Zero Touch Network Access and high-performance connectivity for seamless operations and advanced applications.
Private 5G powered by Celona delivers on the promise of strong security with robust SIM authentication and Celona’s patented MicroSlicing and Aerloc technologies, which ensure reliable service and application-level SLAs, policy enforcement, and zero trust security for business-critical applications.
by Gary Mintchell | Mar 20, 2025 | Networking, News, Organizations
I’ve been a couple of days at Clearwater Beach, Florida attending the 23rd Meeting of ODVA also celebrating the 30th Anniversary of the organization. Thirty years ago I first learned about ODVA and DeviceNet as a sales engineer. I could sense the value but never had a thought that I’d have been writing about the subsequent developments some 30 years later.
The organization seems to be evolving with new technologies and applications. It is a vendor association, and I find it interesting to see the evolution of companies actively supporting the association. Rockwell Automation supplies many engineers still today.
From the press release:
Since ODVA’s founding in 1995, the core Common Industrial Protocol (CIP) technology has evolved significantly and serves as the backbone of the leading EtherNet/IP automation network. The Annual Meeting was attended by over 100 industry leaders from almost 40 companies and included keynotes from Pedro Umbelino, Principal Research Scientist, Bitsight Technologies on “Industry 4.0 Security: Protocols, Risks, Trends and Challenges” and from Craig Resnick, Vice-President, ARC Advisory Group on “Key Trends in Smart Manufacturing and Operational Resilience to Help Navigate Digital Transformation”.
ODVA’s preceding 2025 Industry Conference covered industrial automation relevant topics including the EU Cyber Resilience Act and CIP Security, Artificial Intelligence (AI), IPv6 and EtherNet/IP, 5G and CIP Motion, Metadata for CIP devices, Carbon Neutrality and CIP Energy, EtherNet/IP In-Cabinet, Concurrent Connections, and more. The 23rd Annual Meeting concluded with an announcement regarding the newly elected ODVA leadership along with ODVA’s recent technical accomplishments and future vision.
EtherNet/IP has undergone significant transformation since the 22nd Annual Meeting by continuing to adapt to the requirements of the process industries and through adding additional security capabilities. EtherNet/IP now has expanded process device profiles that include RTD and thermocouple temperature along with level sensors, the ability to combine concurrent connections and CIP Safety, support for PA-DIM version 1.1, and a new device-based firewall and a pull model for configuration to CIP Security. This progress ensures that EtherNet/IP will maintain its leadership position through expanding covered applications and markets, increasing vendor interchangeability, supporting data models for ease of analysis and optimization, and continuing to bolster security to deter bad actors.
ODVA’s 23rd Annual Meeting followed a host of technical papers showcasing the potential future developments of ODVA technologies that were presented at the 2025 Industry Conference. These papers covered technologies including IPv6, which will be included in the EtherNet/IP Specification soon after updates to the specification are finalized and published. IPv6 now makes up almost half of all Internet traffic, and the growing proliferation of IoT devices, sensors, and interconnected machinery on the OT floor demands more address space, which IPv4 cannot provide. In addition to IPv6, presentations also covered:
- Tools available to enable time synchronization for 5G and how they relate to CIP Motion.
- CIP Security protections, including device identity management, secure communication protocols, and vulnerability mitigation, with a view to compliance with the EU Cybersecurity Resilience Act (CRA) and Machinery Safety Act
- An overview of the use of Artificial Intelligence (AI)/Machine Learning (ML) applications in the autonomous train market
- The potential addition of metadata to ODVA’s device description files to provide contextualized presentation of devices both off-line and on-line
- The potential for implementing Bluetooth for industrial use cases with CIP communications as the application layer interface for devices and software clients
- CIP Energy building blocks for real-time energy monitoring, dynamic demand-response capabilities, and energy optimization algorithms that are needed to reach carbon neutrality
- ODVA defined best practices for Concurrent Connections redundancy and a brief plan for the adoption and implementation of Concurrent Connections
- The protection of EDS files that are used to describe a CIP device
- The use cases that FCG – together with ODVA, PNO and OPC Foundation – wish to address
- The expansion of the EtherNet/IP In-cabinet ecosystem
- A user’s perspective on wired EtherNet/IP network architectures
Technical papers and presentations from this and previous ODVA Industry Conference and Annual Meetings are available for download.
by Gary Mintchell | Mar 19, 2025 | Networking, News, Organizations
I am looking over Clearwater Beach, Florida from a terrace at the Hyatt Regency Hotel while on break from the 30th anniversary and 23rd Annual Membership Meeting of ODVA.
This morning’s event included the report of the Technical Review Board and the various Special Interest working Groups. I have some experience from years ago as a member and leader of this type of organization. Members work hard, but at least these days (unlike in my day) physical presence is exchanged with virtual meetings.
The most impressive part of the meeting for me was organization. Eleven chairpeople spoke, yet the time flew. Each rose to the platform, explained the work accomplished during the past year, and concluded with plans for the next 12-18 months. If only more meetings followed this format!
Explaining all the details would have little general interest. Most work was done in the guts of the specifications cleaning up and updating information. Much work went into preparing the specifications for full implementation of IPv6. The hype moment of Time Sensitive Networking (TSN) seems past, but the SIGs continued some work on this. Single-pair Ethernet, Power over Ethernet, and collaboration with I/O Link work continued. Work integrating various specifications with the recent concurrent connections continued. Process Industries group continued working on device profiles.
Reports came from these SIGs, showing the breadth of involvement of members:
- System Architecture
- EtherNet/IP System Architecture
- CIP Security
- Infrastructure
- Physical Layer
- CIP Safety
- Distributed Motion and Time Synchronization
- Common Industrial Cloud Infrastructure
- Process Industries
- I/O Link Integration
- Conformance
