Embedded Computing News From Hannover Messe

Embedded Computing News From Hannover Messe

Amongst the cloud and manufacturing IT booths in Hannover was a sizable booth nestled in the middle housing Arm, the processor company. Here Ian Ferguson, Vice President, Ecosystem Development, met with me to discuss some of the latest embedded computing news.

Arm licenses chips which are optimized to the OS for customer companies to use and customize.

Its software business includes a device manager for small device apps for provisioning and connecting. It has also announced a bridge to IBM Watson.

Its software product, Embed, runs on ARM. Among the areas of focus is smart meters and tracking of small assets. Ferguson also mentioned smart buildings–especially lighting.

Security is a key focus working at the chip level to detect intrusions, “device health”.

News briefs:

• Rapid industry adoption of Mbed Platform with more than 300,000 developers (>30% growth over the past year) and 80 partners

• Arm expands integration with IBM Watson IoT, and partners with Cybertrust and GlobalSign to deliver BYOC (Bring-Your-Own-Certificate) flexible IoT security authentication

• Mbed drives IoT business value for logistics, utilities and smart cities as organizations shift to Industry 4.0

Help organizations take advantage of the opportunities offered by IoT data and combine this with their business data to create valuable business outcomes. However, in talking with these organizations, many feel that pursuing opportunities to achieve these business outcomes through IoT opens themselves up to more IT complexity and greater security concerns.

Security and complexity of integration are legitimate concerns that addressed with Arm Mbed Platform. This platform provides the necessary IoT building blocks including, connectivity, device management, security and provisioning with the support of a 300,000+ strong developer community that has grown more than 30% in the past year.

It’s also supported by a growing ecosystem of 80 contributing partners such as IBM, which is bridging the Mbed Cloud with IBM Watson IoT Platform. We’ve integrated Mbed Cloud with Cybertrust and GlobalSign to provide more flexible security authentication for IoT devices.

Mbed Cloud and Mbed Cloud On Premises were designed to provide device management, connectivity and provisioning that customers demand, supported across multiple public and private clouds, on-premises and hybrid environments.

IoT security should be easy to implement, not an inhibitor. The new integrations between Mbed Cloud and Cybertrust and GlobalSign enable customers to BYOC (Bring-Your-Own-Certificate) for flexible and secure IoT authentication, leveraging the public key infrastructure they already use. Security should also be built into development, which is why Arm is planning to make its free open-sourced development platform, Mbed OS, the first OS to support PSA-Compliant trusted boot, storage and opaque cryptography.

However, even when security is built-in, software updates are often needed to maintain a strong security posture, which is a challenge when there are millions of devices already deployed out in the field. Through an expanded integration with IBM Watson IoT Platform, its users can now manage, provision and update firmware over-the-air for their IoT devices through Mbed Cloud.

Avnu Alliance and TSN Developments at Hannover Messe

Avnu Alliance and TSN Developments at Hannover Messe

Hannover Messe continues to reflect the trend of companies joining alliances to develop and promote standards and interoperability. While I did not have an interview with the Avnu Alliance while I was in Hannover, I talked with some members and obtained other information. Avnu Alliance promotes adoption of the Time Sensitive Networking (TSN) extension to Ethernet.

Specifically, Avnu Alliance is a community creating an interoperable ecosystem of low-latency, time-synchronized, highly reliable networked devices using open standards. Avnu creates comprehensive certification programs to ensure interoperability of networked devices. The foundational technology enables deterministic synchronized networking based on IEEE Audio Video Bridging (AVB) / Time Sensitive Networking (TSN) base standards. The Alliance, in conjunction with other complimentary standards bodies and alliances, provides a united network foundation for use in professional AV, automotive, industrial control and consumer segments.

The adoption pace of TSN from 2017 to 2018 was amazing.

I always drop by the Industrial Internet Consortium (IIC) area at Hannover and check out the TSN Testbed for Flexible Manufacturing. The testbed was developed with two major goals – to show TSN’s readiness to accelerate the marketplace; and to show the business value of TSN in converged, deterministic IIoT networks. Momentum is increasing for the testbed, with the IIC hosting its 10th plugfest in an 18-month timeframe at the Bosch Rexroth facility in Frankfurt, Germany and its 9th plugfest, which was held in Austin, TX in February at National Instruments (NI) headquarters following a joint workshop on interoperability with Avnu Alliance. The TSN Testbed recently integrated test tools from Avnu Alliance members, Calnex, Ixia and Spirent into plugfest activities, and demonstrated interoperability of TSN devices from more than 25 companies performing real-time automation and control automation functions over TSN.

Any Avnu Alliance member is welcome to join the IIC TSN Testbed or to participate in a plugfest. Upcoming plugfests will be held in Austin, TX from June 26-29, 2018 and in Stuttgart from July 24-27, 2018.

The Edge Computing Consortium (ECC) along with members and Avnu Alliance, hosted a press conference to announce new developments surrounding the newly created OPC UA TSN testbed. The testbed demonstrates six major IIoT scenarios mimicking processes found in smart manufacturing settings and utilizing products across different TSN vendors. Avnu Alliance is a key partner supporting the development of the testbed with the ECC in the shared goal of enabling manufacturers to test their products for interoperability and conduct trials of real-world systems as an early check for problems.

Tom Weingartner, Avnu Alliance member and Analog Devices’ marketing director for Deterministic Ethernet Technology Group, represented the Alliance at an announcement ceremony.

Paul Didier, Avnu Alliance member and IoT solutions architect, Cisco delivered a talk at the Industrie 4.0 meet the Industrial Internet Forum, in a presentation titled “Time Sensitive Networks – Where does the technology stand and what to expect”. He will provide an update on TSN and how manufacturers, alliances and liaison groups are working together to advance the technology and its implementation in the IIoT.

Paul will present an additional lecture for the Forum on “Modernizing Your Industrial Manufacturing Network”. The presentation will follow the findings coming out of the IIC TSN Testbed and its capabilities, including information on how manufacturing automation and control infrastructure vendors and key decision-makers can leverage TSN for a variety of operational benefits, including increased connectivity between devices and the ability to extract and analyze valuable information through interconnectivity.

“HANNOVER continues to be a key industry event for both Avnu Alliance members and liaison groups that we work with to educate and increase awareness of TSN as a solution for the growing IIoT,” said Todd Walter, Avnu Alliance Industrial Segment Leader and Chief Marketing Manager at NI. “Whether through the developments coming from the TSN testbeds, speaking engagements or product demonstrations, our members and partners are committed to creating an interoperable TSN network that gives all industrial devices a more streamlined path to participating in the TSN ecosystem.

Hewlett Packard Enterprise Makes Mark at Hannover Messe 2018

Hewlett Packard Enterprise Makes Mark at Hannover Messe 2018

Most of my time involves Hewlett Packard Enterprise (HPE) where I am devoting about 2.5 hours a day to interviews. As one person asked, what does HPE have to offer. Briefly described, HPE has a variety of compute devices, services, and partnerships.

One application was a prescriptive maintenance solution where IoT data is analyzed and the CMMS is notified to initiate a work order. We are not in the era of self-healing machines, yet, but we are one step closer where the machine can begin a maintenance workflow with information about what to repair.

The SecureEdge Data Center combines enclosures from Rittal, I/O from ABB, and Edgeline edge computing hardware from HPE into a scalable industrial center to provide IIoT data to the enterprise from ABB robotics and automation.

As a former machine vision integrator, I loved the video analytics demo application showing Relimetrics software to analyze servers in manufacturing. In this case, the application read a 2D barcode to determine the build, discovered the bill of materials, and then checked that all the proper components were in the assembly, that everything was properly installed, and there were no other defects.

One application of Edgeline edge compute devices, for example, is in partnership with National Instruments to accomplish complex testing at the edge with communication to the cloud as necessary. Edge compute is also important in autonomous vehicles where decisions must be quickly executed locally, but large amounts of data must also be communicated to the cloud for further analysis.

Speaking of partnerships, HPE has forged significant partnerships in the industrial world with ABB, GE Digital, OSIsoft, PTC (Kepware and ThingWorx), Rittal, and Schneider Electric. Most of these involve a significant IT infrastructure including power at the Edge from HPE along with data and connectivity plus solutions targeted to various industrial applications.

Networking and Industrial Software Partnerships

Networking and Industrial Software Partnerships

Partnerships are huge. Especially with industrial automation and software suppliers extending their reach into the enterprise. Here, press releases from rivals Rockwell Automation and Siemens exemplify the pattern. Additionally, this week, I’ve also interviewed Cisco and Intel. Things are getting interesting this spring. We’ll see what I can report back from next week’s Hannover Messe.

Rockwell Automation and Cisco have released new network design guides and white papers to help companies connect mobile devices and deploy end-to-end cloud connectivity while maintaining security best practices. The guides give companies best practices for wired and wireless network architectures when deploying cloud and mobile industrial IoT solutions. The free resources are the latest addition to the Converged Plantwide Ethernet (CPwE) program.

Secure Mobile Connections

The new Identity and Mobility Services guide will help companies connect mobile devices in a way that manages security risks. The guide, based on the Cisco Identity Services Engine platform, supports industrial security by identifying, authorizing and posturing mobile connections at three levels: device, application and user. The guide also helps users establish unified and autonomous WLAN architectures and manage self-service wireless access.

“Mobile devices are changing how we see and manage production,” said Gregory Wilcox, global technology and business development manager, Rockwell Automation. “Workers are accessing analytics on tablets to make better production decisions, even when they’re away from equipment. And they’re using innovations like the FactoryTalk TeamONE app from Rockwell Automation to collaborate through their smartphones. The Identity and Mobility Services guide will help bring these capabilities to life in their facilities while maintaining a strong security stance.”

Connect to the Cloud

The new Cloud Connectivity guide provides guidance for using the FactoryTalk Cloud gateway to establish a more secure connection from the plant floor to cloud-based applications, like FactoryTalk Analytics for Machines. This end-to-end connectivity is essential to deploying capabilities like remote monitoring and support. The design guide addresses the varying levels of security measures that should be considered for small to large companies.

“Industrial companies sometimes focus a lot of their attention on creating an information pathway to the cloud but overlook critical security needs,” said Todd Gurela, senior director, Industry Solutions Group, Cisco. “The Cloud Connectivity design guide will help companies establish end-to-end cloud connectivity while protecting both data paths and the plant network against cyber threats.”

Meanwhile Orange and Siemens

Orange Business Services and Siemens have joined forces to drive the adoption of the Internet of Things (IoT) in the industrial sector by simplifying integration and promoting IoT innovation. The initial focus will be to develop solutions around asset tracking and asset monitoring to optimize the supply chain and improve efficiencies, as well as to develop digitally enhanced products to increase customer satisfaction and create new business models.

The partnership will help businesses connect their machines and physical infrastructure to the digital world, allowing them to translate the wealth of data they produce into business results. Advanced analytics and digital services will help them increase productivity and efficiency across their business.

Orange Business Services brings its global cellular connectivity, consulting, system integration and application development skills to the partnership. The alliance is built around Siemens’ MindSphere, the cloud-based open IoT operating system, and Datavenue, the Orange IoT and data analytics modular offering.

Customers have the option of pre-packaged offerings such as asset tracking, or customized solutions and applications. Orange Business Services will initially provide connectivity components from Datavenue, including cellular and Low Power Wide Area (LPWA) networks. Other Datavenue components will follow.

The partnership will initially focus on Europe, starting with solutions to be rolled out in Germany and Austria.

Are Partnerships the Future of Fieldbuses

Are Partnerships the Future of Fieldbuses

I have been wondering about the future of fieldbuses for quite some time. These include Profibus/Profinet, CC-Link, EtherNet/IP (CIP technologies), and even EtherCAT and PowerLink. Even HART, though not technically a fieldbus, fits the application. And the merger of HART’s organization with Foundation Fieldbus hints at the future.

I think that there will continue to be some development work with these technologies, but I also think that the next big advance will be with Time-Sensitive Networking. At some point in the not-to-distant future, TSN with commercially available components, will be the next communications revolution.

In the meantime, we are seeing what I’ve always believed to be the next useful application whether wired or wireless in industrial networking–gateways and connectors. Here is some news I received from the CC-Link Partner Association relating announcements from the SPS show (which I was unable to attend).

This case involves cooperation between the CC-Link Partner Association (CLPA) and PROFINET & PROFIBUS International (PI). CLPA unveiled the first working coupler device that implements the CC-Link IE/PROFINET interoperability specification. This will enable easy transmission of information between the two protocols, leading to end users and machine builders benefiting from total transparency between CC-Link IE and PROFINET, the two most prevalent networking protocols in Asia and Europe respectively.

Developed by CLPA and PI partner Hilscher, the unveiling of the device marks another milestone in the on-going cooperation between the two associations. The announcement of the first working coupler on the CLPA stand at SPS/IPC/Drives 2017 less than a year after the completion of the specification underlines the importance that the market ascribes to the cooperation between CLPA and PI.

CLPA-Americas Director Robert Miller comments: “The 2015 fair saw the announcement of the cooperation between CLPA and PI, and at the 2016 fair we announced the completion of the specification to enable seamless integration between the two protocols. Now we have the first operating coupler, demonstrating that CLPA and PI, working with their partners, have delivered on the promise to produce working solutions. Hence the promise of increasing transparency and offering maximum flexibility to end users and machine builders as they operate globally has been realized.”

With the new Hilscher coupler, users can effectively achieve communication between different parts of a line on separate networks, hugely increasing transparency and integration. Hilscher’s NT 151-CCIE-RE coupler transmits data bi-directionally between CC-Link IE and PROFINET, offering simple network integration. The NT 151 works as a CC-Link IE Field Intelligent Device on one side and as a PROFINET IO-Device on the other, allowing both network controllers to communicate with each other. Fundamental mechanisms include a mapping model to map data from both sides, diagnostics for coupler and networks, and a SyCon-based DTM which works as the coupler configuration tool.

Hilscher Business Development Manager Armin Pühringer comments: “The simple bridge between the two networks will dramatically reduce the engineering work that has traditionally been necessary to achieve integration across the heterogeneous network architectures that are a fact of life in numerous plants around the world.”

Pühringer adds: “Hilscher has a long relationship with CC-Link based technologies and PROFINET technologies, and going forward both of these will be essential for our business on a global scale. And by facilitating transparency and ease of integration between these two global leaders we are addressing a primary goal of the transition to Industry 4.0: allowing ever greater connectivity by providing end users with a simple method of achieving interoperability in brownfield applications. And all of this without the effort, cost and complexity of requiring communication architectures to support additional technologies or protocols.”

PI Chairman Karsten Schneider comments: “What CLPA and PI have proven here is that two competing organizations can work together for the good of our users. If you really mean what you say about Industry 4.0 and the Industrial Internet of Things, then we will need to see more of this sort of collaboration. CLPA and PI are paving the way, with a level of cooperation that has not been seen before.”

Miller concludes: “The cooperation between CLPA and PI really can help many companies make their vision of Industry 4.0 a reality. The introduction of this first coupler from Hilscher gives machine builders and end users the hardware they need to achieve seamless integration. We are also in discussions with other CLPA partners, so we hope the NT 151 marks the start of the arrival of other products onto the market. The delivery of such solutions to meet end user requirements shows just how committed CLPA and PI have been to deliver tangible results from their cooperation, and how partners such as Hilscher have recognized the market opportunity this represents. They also provide ample evidence of the benefits that can be gained when supposedly competing organizations work together to address their users’ needs.”

 

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