by Gary Mintchell | Mar 24, 2025 | Manufacturing IT, News, Organizations
This news comes from Manufacturing Enterprise Solutions Association (MESA) International promoting its education programs. If you are involved in manufacturing software, you might find these beneficial. Over the years, I’ve heard good things about the courses. I’m not as involved with MESA as I was for years—lots of changes. This program is perhaps the best value from the organization.
The Manufacturing Enterprise Solutions Association (MESA) International announces launch of new MES/MOM Refresher Programs through the MESA Global Education Program. These specialized courses are designed to provide professionals in the manufacturing sector with an updated understanding of Manufacturing Execution Systems (MES) and Manufacturing Operations Management (MOM) methodologies, ensuring they remain at the forefront of industry advancements.
These refresher courses are relevant to those who have completed the foundational MES/MOM certificate program through MESA previously and are looking to enhance their knowledge, stay current with evolving technologies, and strengthen their ability to implement and manage MES/MOM solutions effectively.
Offered in two distinct formats, the new programs include:
- MES/MOM Methodologies CoA Refresher Program – This course offers a comprehensive review of the core concepts, strategies, and best practices associated with MES/MOM methodologies. Participants will deepen their understanding of MES/MOM frameworks and how to apply them to optimize manufacturing operations.
- MES/MOM Methodologies CoC Refresher Program – Tailored for those seeking a deeper dive into MES/MOM systems, this course provides advanced insights into methodologies used to manage and control operations. Attendees will learn how to navigate complex challenges and drive performance improvements across manufacturing processes.
by Gary Mintchell | Mar 20, 2025 | Networking, News, Organizations
I’ve been a couple of days at Clearwater Beach, Florida attending the 23rd Meeting of ODVA also celebrating the 30th Anniversary of the organization. Thirty years ago I first learned about ODVA and DeviceNet as a sales engineer. I could sense the value but never had a thought that I’d have been writing about the subsequent developments some 30 years later.
The organization seems to be evolving with new technologies and applications. It is a vendor association, and I find it interesting to see the evolution of companies actively supporting the association. Rockwell Automation supplies many engineers still today.
From the press release:
Since ODVA’s founding in 1995, the core Common Industrial Protocol (CIP) technology has evolved significantly and serves as the backbone of the leading EtherNet/IP automation network. The Annual Meeting was attended by over 100 industry leaders from almost 40 companies and included keynotes from Pedro Umbelino, Principal Research Scientist, Bitsight Technologies on “Industry 4.0 Security: Protocols, Risks, Trends and Challenges” and from Craig Resnick, Vice-President, ARC Advisory Group on “Key Trends in Smart Manufacturing and Operational Resilience to Help Navigate Digital Transformation”.
ODVA’s preceding 2025 Industry Conference covered industrial automation relevant topics including the EU Cyber Resilience Act and CIP Security, Artificial Intelligence (AI), IPv6 and EtherNet/IP, 5G and CIP Motion, Metadata for CIP devices, Carbon Neutrality and CIP Energy, EtherNet/IP In-Cabinet, Concurrent Connections, and more. The 23rd Annual Meeting concluded with an announcement regarding the newly elected ODVA leadership along with ODVA’s recent technical accomplishments and future vision.
EtherNet/IP has undergone significant transformation since the 22nd Annual Meeting by continuing to adapt to the requirements of the process industries and through adding additional security capabilities. EtherNet/IP now has expanded process device profiles that include RTD and thermocouple temperature along with level sensors, the ability to combine concurrent connections and CIP Safety, support for PA-DIM version 1.1, and a new device-based firewall and a pull model for configuration to CIP Security. This progress ensures that EtherNet/IP will maintain its leadership position through expanding covered applications and markets, increasing vendor interchangeability, supporting data models for ease of analysis and optimization, and continuing to bolster security to deter bad actors.
ODVA’s 23rd Annual Meeting followed a host of technical papers showcasing the potential future developments of ODVA technologies that were presented at the 2025 Industry Conference. These papers covered technologies including IPv6, which will be included in the EtherNet/IP Specification soon after updates to the specification are finalized and published. IPv6 now makes up almost half of all Internet traffic, and the growing proliferation of IoT devices, sensors, and interconnected machinery on the OT floor demands more address space, which IPv4 cannot provide. In addition to IPv6, presentations also covered:
- Tools available to enable time synchronization for 5G and how they relate to CIP Motion.
- CIP Security protections, including device identity management, secure communication protocols, and vulnerability mitigation, with a view to compliance with the EU Cybersecurity Resilience Act (CRA) and Machinery Safety Act
- An overview of the use of Artificial Intelligence (AI)/Machine Learning (ML) applications in the autonomous train market
- The potential addition of metadata to ODVA’s device description files to provide contextualized presentation of devices both off-line and on-line
- The potential for implementing Bluetooth for industrial use cases with CIP communications as the application layer interface for devices and software clients
- CIP Energy building blocks for real-time energy monitoring, dynamic demand-response capabilities, and energy optimization algorithms that are needed to reach carbon neutrality
- ODVA defined best practices for Concurrent Connections redundancy and a brief plan for the adoption and implementation of Concurrent Connections
- The protection of EDS files that are used to describe a CIP device
- The use cases that FCG – together with ODVA, PNO and OPC Foundation – wish to address
- The expansion of the EtherNet/IP In-cabinet ecosystem
- A user’s perspective on wired EtherNet/IP network architectures
Technical papers and presentations from this and previous ODVA Industry Conference and Annual Meetings are available for download.
by Gary Mintchell | Mar 19, 2025 | Networking, News, Organizations
I am looking over Clearwater Beach, Florida from a terrace at the Hyatt Regency Hotel while on break from the 30th anniversary and 23rd Annual Membership Meeting of ODVA.
This morning’s event included the report of the Technical Review Board and the various Special Interest working Groups. I have some experience from years ago as a member and leader of this type of organization. Members work hard, but at least these days (unlike in my day) physical presence is exchanged with virtual meetings.
The most impressive part of the meeting for me was organization. Eleven chairpeople spoke, yet the time flew. Each rose to the platform, explained the work accomplished during the past year, and concluded with plans for the next 12-18 months. If only more meetings followed this format!
Explaining all the details would have little general interest. Most work was done in the guts of the specifications cleaning up and updating information. Much work went into preparing the specifications for full implementation of IPv6. The hype moment of Time Sensitive Networking (TSN) seems past, but the SIGs continued some work on this. Single-pair Ethernet, Power over Ethernet, and collaboration with I/O Link work continued. Work integrating various specifications with the recent concurrent connections continued. Process Industries group continued working on device profiles.
Reports came from these SIGs, showing the breadth of involvement of members:
- System Architecture
- EtherNet/IP System Architecture
- CIP Security
- Infrastructure
- Physical Layer
- CIP Safety
- Distributed Motion and Time Synchronization
- Common Industrial Cloud Infrastructure
- Process Industries
- I/O Link Integration
- Conformance
by Gary Mintchell | Dec 4, 2024 | Automation, News, Organizations, Software
A marketing person offered a meeting with Sanu Warrier, Software Product Director at nVent during the recent Automation Fair. I have not kept up with all mergers and acquisitions. NVent is the parent company of Hoffman enclosures and much more.
My last update from this company was several years ago. I was familiar with electrical enclosure layout CAD software. A customer actually bought one from me in the 90s. But why would there be a director of software and a meeting?
This software has progressed from my time. It provides digital twin technology. Manufacturers, machine builders, and OEMs find this helpful. The software provides information for wire routing, hydraulics and pneumatics information, schematics, panel layout for hole drilling, components library. They incorporate one of my favorite applications included is workflow for building the panel, provides information for cutting and putting connectors of each wire, then information for which wire to assemble next and where to connect it. And, of course, work instructions.
The application is called Assembly Task Manager, Connected Assembly.
Very interesting.
by Gary Mintchell | Nov 25, 2024 | Automation, Networking, News, Organizations
Through the wonders of modern digital networking, I attended the annual ODVA press conference from Nuremberg without the expense of travel. They had two announcements. Perhaps I can make the annual meeting in Florida next March.
EtherNet/IP Concurrent Connections for Critical Applications now Available with CIP Safety
CIP Safety on EtherNet/IP technology has been enhanced to allow for the use of Concurrent Connections for applications requiring both high availability and functional safety. Concurrent Connections allow for communication redundancy between multiple producing and consuming devices for the most critical automation processes. CIP Safety provides fail-safe communication between nodes such as safety I/O blocks, safety interlock switches, safety light curtains and safety controllers in both machine and process automation safety applications up to Safety Integrity Level (SIL) 3 according to IEC 61508 standards. The use of Concurrent Connections with CIP Safety on EtherNet/IP allows for redundancy and functional safety to be integrated to ensure the best uptime and worker safety.
Concurrent Connections are CIP connections that support fault tolerance via redundant devices. Concurrent Connections enable many CIP connection paths, which allows data to be sent multiple times over multiple paths between the producing and consuming devices, independent of how the devices are physically interconnected. Originators, routers, and targets can all have multiple devices participating, and the Concurrent Connection and any of the duplicated device pairs can fulfill the role and the connection. This reduces time that would otherwise be needed to detect failures and eliminates the time that would have to be spent switching between paired devices. The redundant pair send and receive data continuously, so even if a failure is detected in one of the devices, the control process can continue uninterrupted.
CIP Safety mitigates common errors that can result in hazardous situations via various techniques as described in IEC 61784-3-2. Time stamps are used with time expectation to detect if packets are lost, delayed, repeated or transmitted out of order. Unique device identifiers are used to authenticate the communication between two safety devices. Additional diagnostics and checks are included to validate that the messages are not corrupted in transit and all these features are separate from standard communication methods. When these mitigations are put together as CIP Safety, a single connection between two devices (wired or wireless) can be used for communications certified up to SIL 3 per IEC 61508 and up to Category 4/PLe per ISO 13849-1.
“The availability of Concurrent Connections for CIP Safety on EtherNet/IP creates a whole new level of assurance that industrial networks will be both resilient and safe in the face of device failure or communication errors,” according to Dr. Al Beydoun, President and Executive Director of ODVA. “Concurrent Connections for CIP Safety is a win-win that offers the highest availability and functional safety together to enable the toughest applications to be handled while reducing injuries and increasing output.”
CIP Safety and Concurrent Connections have been available separately to provide industrial network functional safety and redundancy in the case of device errors or failure. The purpose of Concurrent Connections for CIP Safety is to provide automation network designers with a way to leverage both the higher system availability advantages offered by standard Concurrent Connections while maintaining the safety integrity offered by CIP Safety connections.
Process Device Profiles for EtherNet/IP Expanded to Include RTD and Thermocouple Temperature Sensors
New process device profiles for temperature sensors are now available as a part of The EtherNet/IPTM Specification. Process device profiles help system integrators and end users to be able to efficiently commission new devices and to more easily replace devices for optimized plant operations. Process device profiles provide standardization for process variables and diagnostics for smoother vendor interoperability and easier controller data integration from EtherNet/IP network capable field devices. Device profiles are available for Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, and now Resistance Temperature Detector (RTD) and thermocouple temperature devices. The value of the standard formatting of process variables, data totals, and diagnostics that process device profiles provide is further enhanced with the new addition of temperature profiles.
The introduction of process device profiles for temperature, in addition to flow and pressure, supports more seamless integration for end users through a greater ecosystem of EtherNet/IP device interchangeability. The temperature device profile contains one instance of the process measurement value object to provide a temperature value and status. The device profile also contains several process device diagnostics instances to provide diagnostic information. Temperature devices measure relative heat or cold using a thermocouple or RTD device. Thermocouples rely on two dissimilar metals joined at one end producing a voltage difference between the two materials to measure temperature. The voltage is directly proportional to the temperature difference between the two ends. RTDs operate based on the principle that the electrical resistance of a metal increases with temperature. RTDs tend to provide greater accuracy while thermocouples can offer a greater temperature sensing range.
“The addition of a new temperature process device profiles for EtherNet/IP provides end users with another valuable tool to enable more efficient device commissioning and replacement,” said Dr. Al Beydoun, President and Executive Director of ODVA. “All EtherNet/IP process device profiles are aligned with the Process Automation Device Information Model (PA-DIM) and NAMUR NE 107 diagnostics. This allows for easier movement of data from the factory floor to the cloud for analysis and action and quicker identification of maintenance issues through standardization.”
EtherNet/IP process device profiles allow for improved vendor interoperability through standardized access to process variables and critical diagnostics such as NAMUR NE 107 status signals as well as more seamless integration with PA-DIM. The addition of temperature devices to EtherNet/IP process device profiles enlarges the ecosystem available devices that offer simpler commissioning and enhanced asset monitoring and integration into higher level PLC, DCS, and cloud-based systems. ODVA is continuing to adapt EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles. Visit odva.org to obtain the latest version of The EtherNet/IP Specification including temperature process devices profiles for EtherNet/IP.
by Gary Mintchell | Nov 20, 2024 | News, Organizations
I’ve written about the market I’ve covered for the past 25 years becoming mature. Symptoms of a mature market include portfolio restructuring to concentrate on a particular segment. We’ve seen this with several of the prominent automation companies. Emerson has also been shedding businesses. They have just announced three more strategic moves.
- Emerson has made a proposal to acquire all outstanding shares of common stock of AspenTech (“AspenTech”) not already owned by Emerson for $240 per share in cash. The proposed transaction follows Emerson’s 55% majority investment in AspenTech, which was completed in 2022. Emerson currently owns approximately 57% of AspenTech’s outstanding shares of common stock. Upon completion of the transaction, AspenTech would become a wholly owned subsidiary of Emerson.
- Emerson has commenced a process to explore strategic alternatives, including a cash sale, for the Safety & Productivity segment, which comprises the remaining businesses not related to automation in Emerson’s portfolio.
- Emerson plans to repurchase approximately $2.0 billion of its common stock in fiscal year 2025, with approximately $1.0 billion of the repurchase expected to be completed in the first quarter of fiscal year 2025.
Emerson believes bringing AspenTech fully into the company accelerates realization of software-defined control. Developments over the last 3 years have proven the value and feasibility of software-defined control.
Companies taking this sort of action always believe in “synergies.” As a single company leveraging the proven Emerson Management System, there will be opportunities for immediate additional cost efficiencies from the transaction. Commercially, the proposed transaction drives greater alignment, collaboration and integration, to allow Emerson and AspenTech to invest, innovate and cross-sell more effectively and drive further sales synergies over time.
Exploring Strategic Alternatives for Safety & Productivity Segment
Emerson also announced today that it is exploring strategic alternatives for its Safety & Productivity segment, including a cash sale, to maximize shareholder value. The segment, which includes Emerson’s legacy tools businesses, contributed $1.4 billion of sales to Emerson in fiscal year 2024, with 24.5% Adjusted Segment EBITA2 margins.
Increasing Return of Capital to Shareholders
Emerson also announced today that it plans to repurchase approximately $2.0 billion of its common stock in fiscal year 2025 increasing its total capital returned to shareholders to approximately 100 percent of the guided free cash flow. Emerson expects to complete approximately $1.0 billion of the repurchase by the end of the first fiscal quarter.
