by Gary Mintchell | Mar 31, 2025 | Networking, News, Organizations, Process Control
The first news from Hannover this morning concerns additions to EtherNet/IP device profiles. Delegates discussed continued updates for process devices at the annual meeting a couple of weeks ago.
ODVA announced that level sensors are the latest option for process device profiles to be added to The EtherNet/IP Specification. Process device profiles help users to reduce complexity and to more quickly install new devices in the event of an unplanned replacement. Standardized semantics and scaling for process variables and diagnostics that are made possible by process device profiles for EtherNet/IP significantly improve vendor interoperability and prepare process data for use with edge and cloud analytics. Device profiles are now available for level measurement along with Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, Resistance Temperature Detector (RTD) and thermocouple temperature sensors. Standardized data including process variables, diagnostics, and totals enable easier access to critical data to help optimize operations. The addition of level sensors to the suite of process device profiles further increases the value of the EtherNet/IP ecosystem.
The goal of process device profiles is to enable a device replacement experience that is as seamless as possible. Plug and play type capabilities for process field devices reduce the need for maintenance workers to be electronic device or Ethernet experts, and they make it possible to increase the efficiency of planned turnarounds while lowering the amount of unplanned downtime. The EtherNet/IP process device profile for level transmitters can be applied to devices that rely on free wave, guided wave, capacitive, magnetostrictive, radiometry, and buoyancy measuring technologies. Additionally, NAMUR NE 107 diagnostics are available for level transmitters that use free wave, guided wave, and radiometry sensor technology approaches. The introduction of level measurement process device profiles, in addition to temperature, flow and pressure, supports end users in being able to integrate EtherNet/IP capable devices in critical environments, to replace sensors regardless of vendor, and to support a harmonized data structure.
“The addition of level sensor support to the suite of EtherNet/IP process device profiles further promotes device interchangeability between vendors and supports easier integration with additional device types,” said Dr. Al Beydoun, President and Executive Director of ODVA. “New level measurement process device profiles for EtherNet/IP network-capable level sensors support NE 107 diagnostics and are aligned with the Process Automation – Device Information Model (PA-DIM). Process device profiles for EtherNet/IP reduce the commissioning and maintenance burden of adopting Ethernet-capable devices and provide a standardized information model foundation to enable usage of advanced edge and cloud analytics approaches, including AI.”
Standardized access to process variables with semantics and scaling that align with PA-DIM and critical diagnostics such as NAMUR NE 107 status signals are the foundation to the future of advanced analytics and optimization within process automation. Process device profiles for EtherNet/IP provide valuable standardization and a growing ecosystem of supported sensors to allow for quicker device installation and replacement, improved asset status, and easier integration into higher level data management systems. ODVA continues to invest in adapting EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles.
Obtain the latest version of The EtherNet/IP Specification including level measurement process devices profiles for EtherNet/IP.
by Gary Mintchell | Mar 31, 2025 | News, Organizations
ODVA have generated still more news—I have some wrap up from a couple of weeks ago when I attended their meeting plus some news this morning from Hannover Messe. (No, I wish I were in Hannover, but I’m still in Illinois.)
The leadership for ODVA’s 24th term was elected and announced at the 23rd Annual Meeting of Members in Clearwater, Florida, USA on March 20, 2025. ODVA has launched a strategic initiative to improve research for future technologies and trends, streamline prioritization and planning, and achieve enhanced operational excellence. This future-focused vision is an effort to be prepared for the challenges of tomorrow and is the result of a comprehensive review process initiated by ODVA’s Board of Directors.
The ODVA Board of Directors has ultimate ownership for strategic planning and governance and is composed of senior executives from leading industrial automation device and system vendors across the world. In the 24th term, ODVA’s Board of Directors are:
• Mr. Franz Durmeier, Head of Digital Integration for Endress+Hauser Process Solutions
• Mr. Jon DeSouza, President and CEO of HARTING Americas for HARTING
• Mr. Toshiyuki Shigehisa, General Manager of the Drive Product Management Group for OMRON
• Mr. Davis Mathews, President of Business Area: Industry Management & Automation for Phoenix Contact
• Mr. Thomas Petersen, Senior Director of Fieldbus and System Integration for Danfoss
• Mr. Brian Reynolds, CTO of Projects & Automation Solutions for Honeywell
• Mr. André Uhl, Vice President of Technology and Architecture of the Industry Automation Business for Schneider Electric
• Mr. Scott Miller, Vice President of Digital and Platform Technologies for Rockwell Automation
The corporate leadership of ODVA jointly defines and executes the strategic plan, oversees development and publication of technology and associated specifications, and is responsible for organizational governance. In the 24th term, ODVA’s corporate officers are:
• Dr. Al Beydoun, President & Executive Director
• Ms. Adrienne Meyer, Vice President of Operations and Membership
• Mr. Christopher Lynch, Corporate Secretary
• Mr. Scott Miller, Treasurer
• Mr. Joakim Wiberg, Chief Technology Officer
ODVA’s Technical Review Board (TRB) oversees the development of technology and standards including approval of technology enhancements for inclusion in the ODVA specifications that encompass the Common Industrial Protocol or “CIP” and its network adaptations of CIP – including EtherNet/IP and DeviceNet. In its 24th term, ODVA’s TRB representatives are:
• Mr. Joakim Wiberg, Chair, ODVA
• Mr. Raj Bandekar of Honeywell
• Mr. Arulkumar Karuppanagounder of Schneider Electric
• Mr. Torben Bertelsen of Danfoss
• Mr. Jörg Reinkensmeier of Endress+Hauser
• Mr. Gregory Majcher of Rockwell Automation
• Mr. Kai Michel of Hilscher
• Mr. Toshiyuki Ozaki of OMRON
ODVA’s Market Advisory Committee (MAC) assesses the state and future of ODVA technologies, including their global and regional adoption and utilization. In its 24th term, ODVA’s MAC representatives are:
· Dr. Vivek Hajarnavis, Chair, Rockwell Automation
· Ms. Adriana Vargas of Honeywell
· Mr. Magnus Jansson of HMS Networks
· Mr. McKenzie Reed of HARTING
· Ms. Tonya Wyatt of Micro Motion (Emerson)
· Ms. Feiyan Zhao of Schneider Electric
· Mr. Arnold Offner of Phoenix Contact
“ODVA is entering into its 24th term with a concentrated focus on preparing for a connected future driven by technologies like Single Pair Ethernet (SPE), standardized information models, and Artificial Intelligence as well as a continued emphasis on the use of open technologies, vendor interoperability, and safety and security. The celebration of ODVA’s 30th anniversary is a reminder of the importance of adapting to future oriented technologies and preparing for accelerating change,” said Dr. Al Beydoun, President and Executive Director at ODVA. “ODVA’s experienced and talented leadership team are working diligently together to ensure that EtherNet/IP is ready for the challenges and opportunities of tomorrow.”
ODVA anticipates that it will announce the dates and location for its 2026 Industry Conference & 24th Annual Meeting by Q4 2025.
by Gary Mintchell | Mar 24, 2025 | Manufacturing IT, News, Organizations
This news comes from Manufacturing Enterprise Solutions Association (MESA) International promoting its education programs. If you are involved in manufacturing software, you might find these beneficial. Over the years, I’ve heard good things about the courses. I’m not as involved with MESA as I was for years—lots of changes. This program is perhaps the best value from the organization.
The Manufacturing Enterprise Solutions Association (MESA) International announces launch of new MES/MOM Refresher Programs through the MESA Global Education Program. These specialized courses are designed to provide professionals in the manufacturing sector with an updated understanding of Manufacturing Execution Systems (MES) and Manufacturing Operations Management (MOM) methodologies, ensuring they remain at the forefront of industry advancements.
These refresher courses are relevant to those who have completed the foundational MES/MOM certificate program through MESA previously and are looking to enhance their knowledge, stay current with evolving technologies, and strengthen their ability to implement and manage MES/MOM solutions effectively.
Offered in two distinct formats, the new programs include:
- MES/MOM Methodologies CoA Refresher Program – This course offers a comprehensive review of the core concepts, strategies, and best practices associated with MES/MOM methodologies. Participants will deepen their understanding of MES/MOM frameworks and how to apply them to optimize manufacturing operations.
- MES/MOM Methodologies CoC Refresher Program – Tailored for those seeking a deeper dive into MES/MOM systems, this course provides advanced insights into methodologies used to manage and control operations. Attendees will learn how to navigate complex challenges and drive performance improvements across manufacturing processes.
by Gary Mintchell | Mar 20, 2025 | Networking, News, Organizations
I’ve been a couple of days at Clearwater Beach, Florida attending the 23rd Meeting of ODVA also celebrating the 30th Anniversary of the organization. Thirty years ago I first learned about ODVA and DeviceNet as a sales engineer. I could sense the value but never had a thought that I’d have been writing about the subsequent developments some 30 years later.
The organization seems to be evolving with new technologies and applications. It is a vendor association, and I find it interesting to see the evolution of companies actively supporting the association. Rockwell Automation supplies many engineers still today.
From the press release:
Since ODVA’s founding in 1995, the core Common Industrial Protocol (CIP) technology has evolved significantly and serves as the backbone of the leading EtherNet/IP automation network. The Annual Meeting was attended by over 100 industry leaders from almost 40 companies and included keynotes from Pedro Umbelino, Principal Research Scientist, Bitsight Technologies on “Industry 4.0 Security: Protocols, Risks, Trends and Challenges” and from Craig Resnick, Vice-President, ARC Advisory Group on “Key Trends in Smart Manufacturing and Operational Resilience to Help Navigate Digital Transformation”.
ODVA’s preceding 2025 Industry Conference covered industrial automation relevant topics including the EU Cyber Resilience Act and CIP Security, Artificial Intelligence (AI), IPv6 and EtherNet/IP, 5G and CIP Motion, Metadata for CIP devices, Carbon Neutrality and CIP Energy, EtherNet/IP In-Cabinet, Concurrent Connections, and more. The 23rd Annual Meeting concluded with an announcement regarding the newly elected ODVA leadership along with ODVA’s recent technical accomplishments and future vision.
EtherNet/IP has undergone significant transformation since the 22nd Annual Meeting by continuing to adapt to the requirements of the process industries and through adding additional security capabilities. EtherNet/IP now has expanded process device profiles that include RTD and thermocouple temperature along with level sensors, the ability to combine concurrent connections and CIP Safety, support for PA-DIM version 1.1, and a new device-based firewall and a pull model for configuration to CIP Security. This progress ensures that EtherNet/IP will maintain its leadership position through expanding covered applications and markets, increasing vendor interchangeability, supporting data models for ease of analysis and optimization, and continuing to bolster security to deter bad actors.
ODVA’s 23rd Annual Meeting followed a host of technical papers showcasing the potential future developments of ODVA technologies that were presented at the 2025 Industry Conference. These papers covered technologies including IPv6, which will be included in the EtherNet/IP Specification soon after updates to the specification are finalized and published. IPv6 now makes up almost half of all Internet traffic, and the growing proliferation of IoT devices, sensors, and interconnected machinery on the OT floor demands more address space, which IPv4 cannot provide. In addition to IPv6, presentations also covered:
- Tools available to enable time synchronization for 5G and how they relate to CIP Motion.
- CIP Security protections, including device identity management, secure communication protocols, and vulnerability mitigation, with a view to compliance with the EU Cybersecurity Resilience Act (CRA) and Machinery Safety Act
- An overview of the use of Artificial Intelligence (AI)/Machine Learning (ML) applications in the autonomous train market
- The potential addition of metadata to ODVA’s device description files to provide contextualized presentation of devices both off-line and on-line
- The potential for implementing Bluetooth for industrial use cases with CIP communications as the application layer interface for devices and software clients
- CIP Energy building blocks for real-time energy monitoring, dynamic demand-response capabilities, and energy optimization algorithms that are needed to reach carbon neutrality
- ODVA defined best practices for Concurrent Connections redundancy and a brief plan for the adoption and implementation of Concurrent Connections
- The protection of EDS files that are used to describe a CIP device
- The use cases that FCG – together with ODVA, PNO and OPC Foundation – wish to address
- The expansion of the EtherNet/IP In-cabinet ecosystem
- A user’s perspective on wired EtherNet/IP network architectures
Technical papers and presentations from this and previous ODVA Industry Conference and Annual Meetings are available for download.
by Gary Mintchell | Mar 19, 2025 | Networking, News, Organizations
I am looking over Clearwater Beach, Florida from a terrace at the Hyatt Regency Hotel while on break from the 30th anniversary and 23rd Annual Membership Meeting of ODVA.
This morning’s event included the report of the Technical Review Board and the various Special Interest working Groups. I have some experience from years ago as a member and leader of this type of organization. Members work hard, but at least these days (unlike in my day) physical presence is exchanged with virtual meetings.
The most impressive part of the meeting for me was organization. Eleven chairpeople spoke, yet the time flew. Each rose to the platform, explained the work accomplished during the past year, and concluded with plans for the next 12-18 months. If only more meetings followed this format!
Explaining all the details would have little general interest. Most work was done in the guts of the specifications cleaning up and updating information. Much work went into preparing the specifications for full implementation of IPv6. The hype moment of Time Sensitive Networking (TSN) seems past, but the SIGs continued some work on this. Single-pair Ethernet, Power over Ethernet, and collaboration with I/O Link work continued. Work integrating various specifications with the recent concurrent connections continued. Process Industries group continued working on device profiles.
Reports came from these SIGs, showing the breadth of involvement of members:
- System Architecture
- EtherNet/IP System Architecture
- CIP Security
- Infrastructure
- Physical Layer
- CIP Safety
- Distributed Motion and Time Synchronization
- Common Industrial Cloud Infrastructure
- Process Industries
- I/O Link Integration
- Conformance
by Gary Mintchell | Dec 4, 2024 | Automation, News, Organizations, Software
A marketing person offered a meeting with Sanu Warrier, Software Product Director at nVent during the recent Automation Fair. I have not kept up with all mergers and acquisitions. NVent is the parent company of Hoffman enclosures and much more.
My last update from this company was several years ago. I was familiar with electrical enclosure layout CAD software. A customer actually bought one from me in the 90s. But why would there be a director of software and a meeting?
This software has progressed from my time. It provides digital twin technology. Manufacturers, machine builders, and OEMs find this helpful. The software provides information for wire routing, hydraulics and pneumatics information, schematics, panel layout for hole drilling, components library. They incorporate one of my favorite applications included is workflow for building the panel, provides information for cutting and putting connectors of each wire, then information for which wire to assemble next and where to connect it. And, of course, work instructions.
The application is called Assembly Task Manager, Connected Assembly.
Very interesting.
