Here’s a chance to meet me and share your thoughts about what I should really be writing about. Plus getting the latest updates from Inductive Automation and its partners.
The Ignition Community Conference, ICC2026, will be held again in Sacramento September 22-24. Tickets are now available. See you there.
This news release falls clearly into the category of Duh!!!
Human social engineering and humans gaining unauthorized access while serving as contractors and the like have long been known to be a cybersecurity risk. But, I’m happy to note that an august group has perceived the obvious.
The Industrial Security Harmonization Group (ISHG) has released a joint industry perspective highlighting a critical truth in industrial cybersecurity: secure communication is not determined by protocols alone, but by how they are deployed and managed in real-world environments.
Or, maybe, it’s along the lines of “it’s not all our fault?”
The ISHG—comprising leading industry organizations including the FieldComm Group, ODVA, OPC Foundation, and PROFIBUS & PROFINET International—collaborates regularly to align security concepts across Ethernet and non-Ethernet communication protocol technologies. Their shared mission is to reduce complexity for end users and promote consistent, effective cybersecurity practices in industrial automation systems.
I once set at an industrial communication organization meeting where an end-user pleaded for application guidelines. He was studiously ignored.
Industrial communication protocols serve as the backbone of modern automation, enabling seamless connectivity between devices, systems, and applications across both process and factory environments. However, many widely used protocols were originally developed without cybersecurity as a primary design consideration.
It now emphasizes a more practical and realistic approach:
My last post discussed how the market has changed enough that consolidation of technology and business associations has become inevitable. And there are benefits. This news shows some of the benefits of previously competing organizations working together.
In brief:
Updated FDI technology specification paves the way for single device integration for process and factory automation device management.
FieldComm Group’s Strategic Integration Committee (SIC), composed of leading automation industry suppliers and Standards Development Organizations (SDOs), has announced the official timeline for releasing the updated Field Device Integration (FDI) Specification. This milestone marks a critical step toward unifying device integration across process, hybrid, and factory automation.
Following the transfer of FDT/DTM assets to FieldComm Group in 2024, the organization has significantly accelerated its efforts toward unified device integration. The resulting roadmap is a product of coordinated work by the SIC and specialized working groups. Comprised of board-level companies from FieldComm Group along with key leaders from OPC Foundation, ODVA, and PROFIBUS & PROFINET International (PI), the SIC has led the harmonization of FDI and FDT technologies. This collaboration aims to deliver a unified, intuitive, and scalable device integration standard that addresses the evolving needs of modern manufacturing, helping both end users and vendors.
Key enhancements in the updated FDI Specification:
FDI specification timeline for migration:
Following are statements of leaders of participating organizations:
“Today’s industrial systems are more complex than ever, yet this complexity must not compromise interoperability,” said Steve Biegacki, Chair of the Strategic Integration Committee and former Managing Director of the FDT Group. “Our goal is to deliver a unified device integration solution that enhances data interoperability with OT/IT systems while supporting innovative features for modern manufacturing. This approach also provides a practical migration path, safeguarding existing investments and preparing the industry for future advancements.”
“As a co-owner of the FDI specification, the OPC Foundation is committed to robust and interoperable device integration for OPC UA users and fully supports the harmonization of FDI and FDT technologies to achieve this goal,” said Stefan Hoppe, President of the OPC Foundation.
“ODVA is pleased to support the harmonization of FDI and FDT technologies to enable enhanced device integration interoperability for users of EtherNet/IP,” said Al Beydoun, President and Executive Director of ODVA.
“PI appreciates that the FieldComm Group initiated the valuable discussions to determine the need for merging FDI and FDT, taking into account the needs of interested companies, as well as the technologies of the four participating standards development associations,” said Dietmar Bohn, Executive Director of PI.
Final statement of benefits:
This update will enable manufacturers to transition toward more intelligent, responsive operations, unlocking the full value of industrial data and modern automation architectures.
Things are tough these days for associations. I still belong to one, but I’m only peripherally involved for a few years. We’ve witnessed consolidation of the industrial networking and fieldbus organizations. This announcement notes the finalization of yet another pair of associations only a year following a consolidation within one of the pair.
I wrote in February 2024, Two major sources of technology buzz from around 2015 to 2020 or so found homes in industry consortia within The Object Management Group. I talked often with people from the IIC, aka Industry IoT Consortium, and with the Digital Twin Consortium. These were most likely too much overhead for the supporting suppliers and industry. They have merged under The Object Management Group.
Again I wrote just a few weeks ago, EDM Council and Object Management Group Combine to Create Global End-to-End Data and Standards Authority. First-of-its-kind non-profit trade association to foster the growth of data, software, systems, knowledge engineering, and standards capability.
And now we have the announcement regarding the successful completion of this consolidation. One paragraph talks of the acquisition of the assets, while another discusses the acquisition of the organization. Regardless, companies supporting all the efforts now only have one set of dues to pay.
EDM Association, the global trade association for data management and technology standards, announces the successful completion of its acquisition of the assets of the Object Management Group (OMG), the open membership, not-for-profit technology consortium. This unites two organizations with complementary expertise, creating the world’s largest association for data, software, systems, and standards professionals.
The acquisition strategically aligns OMG’s globally adopted standards, frameworks, and communities—including the OMG Standards Development Organization (SDO), Digital Twin Consortium, AREA (Augmented Reality for Enterprise Alliance), and CISQ (Consortium for Information and Software Quality)—with EDM Association’s data management best practices and professional development programs. By leveraging a single authoritative standards partner and global expert community, members will have a wider range of tools, support, training and expertise to advance data and technology, including AI, to drive better outcomes for their organizations.
Key Benefits of the Acquisition:
The first news from Hannover this morning concerns additions to EtherNet/IP device profiles. Delegates discussed continued updates for process devices at the annual meeting a couple of weeks ago.
ODVA announced that level sensors are the latest option for process device profiles to be added to The EtherNet/IP Specification. Process device profiles help users to reduce complexity and to more quickly install new devices in the event of an unplanned replacement. Standardized semantics and scaling for process variables and diagnostics that are made possible by process device profiles for EtherNet/IP significantly improve vendor interoperability and prepare process data for use with edge and cloud analytics. Device profiles are now available for level measurement along with Coriolis flow, electromagnetic flow, vortex flow, standard pressure, scaled pressure, Resistance Temperature Detector (RTD) and thermocouple temperature sensors. Standardized data including process variables, diagnostics, and totals enable easier access to critical data to help optimize operations. The addition of level sensors to the suite of process device profiles further increases the value of the EtherNet/IP ecosystem.
The goal of process device profiles is to enable a device replacement experience that is as seamless as possible. Plug and play type capabilities for process field devices reduce the need for maintenance workers to be electronic device or Ethernet experts, and they make it possible to increase the efficiency of planned turnarounds while lowering the amount of unplanned downtime. The EtherNet/IP process device profile for level transmitters can be applied to devices that rely on free wave, guided wave, capacitive, magnetostrictive, radiometry, and buoyancy measuring technologies. Additionally, NAMUR NE 107 diagnostics are available for level transmitters that use free wave, guided wave, and radiometry sensor technology approaches. The introduction of level measurement process device profiles, in addition to temperature, flow and pressure, supports end users in being able to integrate EtherNet/IP capable devices in critical environments, to replace sensors regardless of vendor, and to support a harmonized data structure.
“The addition of level sensor support to the suite of EtherNet/IP process device profiles further promotes device interchangeability between vendors and supports easier integration with additional device types,” said Dr. Al Beydoun, President and Executive Director of ODVA. “New level measurement process device profiles for EtherNet/IP network-capable level sensors support NE 107 diagnostics and are aligned with the Process Automation – Device Information Model (PA-DIM). Process device profiles for EtherNet/IP reduce the commissioning and maintenance burden of adopting Ethernet-capable devices and provide a standardized information model foundation to enable usage of advanced edge and cloud analytics approaches, including AI.”
Standardized access to process variables with semantics and scaling that align with PA-DIM and critical diagnostics such as NAMUR NE 107 status signals are the foundation to the future of advanced analytics and optimization within process automation. Process device profiles for EtherNet/IP provide valuable standardization and a growing ecosystem of supported sensors to allow for quicker device installation and replacement, improved asset status, and easier integration into higher level data management systems. ODVA continues to invest in adapting EtherNet/IP to the full requirements of the process industries through support of technologies including Ethernet-APL, PA-DIM, NAMUR, FDI, and process device profiles.
Obtain the latest version of The EtherNet/IP Specification including level measurement process devices profiles for EtherNet/IP.
ODVA have generated still more news—I have some wrap up from a couple of weeks ago when I attended their meeting plus some news this morning from Hannover Messe. (No, I wish I were in Hannover, but I’m still in Illinois.)
The leadership for ODVA’s 24th term was elected and announced at the 23rd Annual Meeting of Members in Clearwater, Florida, USA on March 20, 2025. ODVA has launched a strategic initiative to improve research for future technologies and trends, streamline prioritization and planning, and achieve enhanced operational excellence. This future-focused vision is an effort to be prepared for the challenges of tomorrow and is the result of a comprehensive review process initiated by ODVA’s Board of Directors.
The ODVA Board of Directors has ultimate ownership for strategic planning and governance and is composed of senior executives from leading industrial automation device and system vendors across the world. In the 24th term, ODVA’s Board of Directors are:
• Mr. Franz Durmeier, Head of Digital Integration for Endress+Hauser Process Solutions
• Mr. Jon DeSouza, President and CEO of HARTING Americas for HARTING
• Mr. Toshiyuki Shigehisa, General Manager of the Drive Product Management Group for OMRON
• Mr. Davis Mathews, President of Business Area: Industry Management & Automation for Phoenix Contact
• Mr. Thomas Petersen, Senior Director of Fieldbus and System Integration for Danfoss
• Mr. Brian Reynolds, CTO of Projects & Automation Solutions for Honeywell
• Mr. André Uhl, Vice President of Technology and Architecture of the Industry Automation Business for Schneider Electric
• Mr. Scott Miller, Vice President of Digital and Platform Technologies for Rockwell Automation
The corporate leadership of ODVA jointly defines and executes the strategic plan, oversees development and publication of technology and associated specifications, and is responsible for organizational governance. In the 24th term, ODVA’s corporate officers are:
• Dr. Al Beydoun, President & Executive Director
• Ms. Adrienne Meyer, Vice President of Operations and Membership
• Mr. Christopher Lynch, Corporate Secretary
• Mr. Scott Miller, Treasurer
• Mr. Joakim Wiberg, Chief Technology Officer
ODVA’s Technical Review Board (TRB) oversees the development of technology and standards including approval of technology enhancements for inclusion in the ODVA specifications that encompass the Common Industrial Protocol or “CIP” and its network adaptations of CIP – including EtherNet/IP and DeviceNet. In its 24th term, ODVA’s TRB representatives are:
• Mr. Joakim Wiberg, Chair, ODVA
• Mr. Raj Bandekar of Honeywell
• Mr. Arulkumar Karuppanagounder of Schneider Electric
• Mr. Torben Bertelsen of Danfoss
• Mr. Jörg Reinkensmeier of Endress+Hauser
• Mr. Gregory Majcher of Rockwell Automation
• Mr. Kai Michel of Hilscher
• Mr. Toshiyuki Ozaki of OMRON
ODVA’s Market Advisory Committee (MAC) assesses the state and future of ODVA technologies, including their global and regional adoption and utilization. In its 24th term, ODVA’s MAC representatives are:
· Dr. Vivek Hajarnavis, Chair, Rockwell Automation
· Ms. Adriana Vargas of Honeywell
· Mr. Magnus Jansson of HMS Networks
· Mr. McKenzie Reed of HARTING
· Ms. Tonya Wyatt of Micro Motion (Emerson)
· Ms. Feiyan Zhao of Schneider Electric
· Mr. Arnold Offner of Phoenix Contact
“ODVA is entering into its 24th term with a concentrated focus on preparing for a connected future driven by technologies like Single Pair Ethernet (SPE), standardized information models, and Artificial Intelligence as well as a continued emphasis on the use of open technologies, vendor interoperability, and safety and security. The celebration of ODVA’s 30th anniversary is a reminder of the importance of adapting to future oriented technologies and preparing for accelerating change,” said Dr. Al Beydoun, President and Executive Director at ODVA. “ODVA’s experienced and talented leadership team are working diligently together to ensure that EtherNet/IP is ready for the challenges and opportunities of tomorrow.”
ODVA anticipates that it will announce the dates and location for its 2026 Industry Conference & 24th Annual Meeting by Q4 2025.
