by Gary Mintchell | May 9, 2023 | Automation, Embedded Control, Internet of Things, Networking, Technology, Wireless
Qualcomm’s product development department has been busy extending the chip-maker’s presence in the smart device market. This news release announces what they term to be next-generation IoT devices. The new devices are Qualcomm QCS8550, Qualcomm QCM8550, Qualcomm® QCS4490 and Qualcomm® QCM4490 Processors.
- The new Qualcomm QCS8550 and Q/CM8550 Processors combine maximum compute power, extreme edge AI processing, Wi-Fi 7 connectivity, and vivid graphics and video to enable and quickly deploy performance-heavy IoT applications, such as autonomous mobile robots and industrial drones.
- The Qualcomm QCS4490 and QCM4490 Processors deliver key advanced features such as premium connectivity and next-gen processing to industrial handheld and computing devices. The solutions are equipped with both 5G and Wi-Fi 6E for multi-gigabit speeds, extended range, and low latency, and powerful, efficient processing to handle complex computing tasks. The Qualcomm QCS4490 and QCM4490 Processors are designed with planned support for Android releases through version 18, meaning they can be used in industrial designs through 2030, providing flexibility and longevity for maximizing development time and cost savings.
by Gary Mintchell | Apr 26, 2023 | Networking, News, Organizations, Standards
ODVA announced that process device profiles have been added to The EtherNet/IPTM Specification to provide automation practitioners with another critical tool to help optimize plant operations. Process device profiles provide a standard format for process variables and diagnostics across an array of devices for smoother vendor interoperability and easier DCS and PLC data integration from EtherNet/IP-enabled field devices.
Device profiles are available for Coriolis flow, electromagnetic flow, vortex flow, standard pressure, and scaled pressure devices. Process end users can now take advantage of EtherNet/IP devices with better communication of critical diagnostics such as NAMUR NE 107 status signals, and improved alignment with the Process Automation Device Information Model (PA-DIM).
EtherNet/IP process device profiles are made up of process measurement value objects for variables such as current pressure, level, flow, etc., process totalized value objects that track cumulative data totals such as total flow, and process device diagnostics objects that enable plant operators and maintenance personnel easier access to additional device and process status information. Process device profiles help convert sensor signals and actuator positions into valuable information that enables action to be taken to improve product quality and operational efficiency. Additionally, process device profiles can help evaluate the reliability of the measuring signal and aid in preventing plant shutdowns by identifying premature device failures.
As an example, the process totalized value object can track total device usage and device health can be inferred from the process measurement value and diagnostics objects. This allows users to shift from time-based maintenance to condition-based maintenance, potentially saving devices from unnecessarily being replaced during plant shutdowns while identifying other devices that are failing prematurely, which can reduce both unnecessary maintenance costs and potential downtime.
The EtherNet/IP process device profiles were designed with additional parameters and modified data types to better align with PA-DIM, which is a joint standard between FieldComm Group, ISA100 WCI, NAMUR, ODVA, OPC Foundation, PI, VDMA, and ZVEI. PA-DIM represents information from process devices in a standardized way for easier access.
In addition to exposing measurement values and the quality or status of those values, EtherNet/IP process device profiles can also simulate the measurement values. This enables critical safety functions such as partial stroke tests in valves to take place without interfering with the process data. The standard formatting of live process variables, data totals, and diagnostics that process device profiles provide will also increase vendor interoperability for end users given that the information will be the same across EtherNet/IP devices, regardless of vendor.
The addition of process device profiles adds to the process automation capability of EtherNet/IP, including the ability to use the Ethernet-APL physical layer. Ethernet-APL unlocks the advantages of commercially based industrial control hardware, an object-oriented foundation, and standard internet protocol compatibility including TCP/IP, HTTP, FTP, SNMP, and DHCP in process plants. Ethernet-APL is a combination of Single Pair Ethernet (IEEE 802.3cg-2019, 10BASE-T1L), engineered power, Intrinsic Safety (IEC 60079, 2-WISE), and Type A fieldbus cable (IEC 61158-2, for intrinsic safety) that is able to reach 1,000 meter distances and speeds of 10Mbit/s.
Additionally, EtherNet/IP supports process automation through NE 107 diagnostics, HART integration, and IO-Link integration. Further, ODVA is continuing to expand the EtherNet/IP ecosystem with the next generation of digitized device description files, including FDT, FDI, and xDS, to simplify integration into process asset management tools. Lastly, ODVA has also just released the availability of concurrent connections allowing for failsafe controller redundancy for the most critical of process applications.
“The introduction of process device profiles to EtherNet/IP is another critical step in meeting the full set of requirements of the process industries,” said Dr. Al Beydoun, President and Executive Director of ODVA. “EtherNet/IP process device profiles will help end users operate plants with superior yields, minimal downtime, and reduced costs. Additionally, better integration with PA-DIM will help process automation practitioners have the most valuable diagnostics and process variables available in both the control room and in the cloud to allow for enhanced insights and timely intervention measures for optimization of operations.”
EtherNet/IP process device profiles enable enhanced vendor interoperability, easier access to process variables and critical diagnostics such as NAMUR NE 107 status signals, and more seamless integration with PA-DIM. Additionally, process field device profiles will allow for simpler commissioning and enhanced asset monitoring and integration into higher level PLC, DCS, and cloud-based systems. Visit odva.org to obtain the latest version of The EtherNet/IP Specification including process devices profiles for EtherNet/IP.
by Gary Mintchell | Apr 24, 2023 | Networking, Wireless
Betacom recently talked with me about its new Private 5G Ecosystem. To me the term ecosystem implies a (usually) proprietary software platform where a company hopes to recruit a critical mass of companies to commit. This ecosystem looks more like what I’ve been taught to be more resilient and perhaps useful—loosely coupled. And certainly private 5G networks are finally coming to fruition after a long gestation.
Betacom and its partners, including Google Cloud, Intel, Ingram Micro Inc. and Qualcomm Technologies, are collaborating to design, validate and deploy solutions for a variety of enterprise applications – setting the stage for the next phase of economic and business evolution driven by connectivity, automation, artificial intelligence, machine learning and real-time data. (I apologize for allowing almost every buzz word into the article.)
The partner initiative will help to expedite solutions through open collaboration aimed at building an ecosystem of pre-tested Industrial IoT devices and applications, integrated with mobile edge compute, supported by established system integrators and powered by private 5G.
The ecosystem currently includes 15 companies from across the technology spectrum – each with unique domain and industry expertise. Charter members include:
- Industrial IoT Devices:, Axis Communications, Ingram Micro Inc., Qualcomm Technologies, SVT Robotics, and Vecna Robotics
- Applications: ADB SAFEGATE Americas, Evolon, Ingram Micro Inc., and Solis Energy
- Mobile Edge Compute: Google Cloud, Ingram Micro Inc., and Intel
- System Integrators: CDW, Ingram Micro Inc., and QuayChain 5GaaS Technology: Airspan, Druid Software, FibroLAN, and Qualcomm Technologies
by Gary Mintchell | Mar 10, 2023 | Networking, News
More news from the Mobile World Congress in Barcelona, this one concerning working with telco networks.
In brief:
- New network Application Programming Interfaces (APIs) will enable developers to build and innovate with telco network capabilities
- Deutsche Telekom and T-Mobile US address global use cases with joint platform and new network APIs
- First partner: Siemens Energy optimizes user experience for remote maintenance using a Quality-on-Demand (QoD) API
- Collaboration with Microsoft will make it easier for developers to access the network APIs via Microsoft Azure Programmable Connectivity
Deutsche Telekom and T-Mobile US have developed a platform with joint Application Programming Interfaces (APIs) – called T-DevEdge – to make it easy and simple for the global developer community to create new, connected solutions. These APIs will give developers a direct and simplified entryway to connectivity and other core network services on both sides of the Atlantic.
As one of the first, Siemens Energy is using one of the new APIs for Quality-on-Demand to optimize its remote maintenance. Microsoft is the first cloud provider to integrate the new set of network APIs into their cloud platform through the Microsoft Azure Programmable Connectivity Software Development Kit (SDK).
To ensure that global standards for APIs are defined and used, Deutsche Telekom, among others, founded the CAMARA Alliance. The CAMARA initiative consists of network operators, cloud providers, application developers and technology and operating system vendors. The alliance was announced during the MWC in 2022 and has grown up to eleven API families, more than 50 partners and more than 300 people working in the different groups of the community.
by Gary Mintchell | Mar 8, 2023 | Automation, Networking, Wireless
Moxa sends releases about new products at times. I don’t write about the essential backbone of automation/IoT/digital transformation often enough. It’s not always sexy. But it is essential. Maybe 5G gets a little sexy, but implementation seems still distant.
This news concerns wireless networking designed to enhance Autonomous Guided Vehicles and Autonomous Mobile Robots. These solutions continue to gain traction not only in warehousing but also in manufacturing.
Moxa introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified security, and dual-band Turbo Roaming for unmatched wireless reliability and availability. When combined, these advanced features meet the current and future demands of applications where Autonomous Guided Vehicles (AGVs) and Autonomous Mobile Robots (AMRs) are at the heart of boosting productivity and operational safety, such as mobile automation and IP surveillance in mining, manufacturing, healthcare, and transportation, among others. The Moxa AWK Series is made up of three models: the AWK-3252A, AWK-4252A, and AWK-1151C AP/bridge/client.
Moxa AWK Series AP/bridge/clients simplify wireless operations and the integration of mobile systems outfitted with complex sensors and cameras, while also addressing the heightened requirements for industrial-grade reliable networks. With speeds of up to 400 Mbps on the 2.4 GHz band and 867 Mbps on the 5 GHz band, AWK Series AP/bridge/clients enable a high-bandwidth, dynamic mobile environment to accommodate a large number of devices and support high-volume data communication. In addition, support for one-to-many network address translation (1-to-n NAT) helps optimize the machine integration flow by simplifying IP address assignment while avoiding IP conflicts between existing devices connecting to the OT network wirelessly.
by Gary Mintchell | Mar 1, 2023 | Automation, Networking, News, Technology
Qualcomm participated in the deluge of 5G news emanating from Mobile World Congress in Barcelona. Oh, yes, I still wish I were there. There were probably not enough contacts to justify the trip, though. Here are the five pieces of news I’ve received.
- 5G Advanced-Ready Modem-RF System
- Globally Certified Module Reference Designs
- Dell Technologies For 5G Open RAN
- Schneider Electric and CapGemini for Industrial 5G
- Simplify and Accelerate IoT
World’s First 5G Advanced-Ready Modem-RF System
Highlights:
- Snapdragon X75 5G Modem-RF System sets the benchmark for smartphone connectivity with the world’s first 5G Advanced-ready Modem-RF System
- Snapdragon X75 is also designed to drive the next stage of 5G evolution in all key verticals including vehicles, PCs, Industrial IoT and more.
- Powered by Snapdragon X75, Qualcomm Fixed Wireless Access Platform Gen 3 is the world’s first fully integrated 5G Advanced-ready fixed wireless access platform for 5G fixed internet access with an aim to bridge the digital divide.
Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm® 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm® 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world’s first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.
Globally Certified Module Reference Designs
Highlights:
- Snapdragon X75, X72, and X35 5G M.2 and LGA Reference Designs aim to make 5G readily available for various product segments such as FWA, compute, gaming, and more.
- Globally certified turnkey reference designs optimize development costs to enable faster time to market.
- Reference designs are currently sampling with commercialization starting in the second half of 2023.
Qualcomm Technologies, Inc. announced the Snapdragon X75, X72, and X35 5G M.2 and LGA Reference Designs, which expand on the previous announcement from February 2022. Leveraging the latest, most robust features of Snapdragon X75, X72, and X35 5G Modem-RF Systems, this product portfolio offers OEMs a turnkey solution, globally certified to work with 5G networks from all key mobile network operators worldwide, thus allowing to develop the next generation 5G devices and bring consumers a wide spectrum of 5G-enabled devices from PCs to XR to gaming, and beyond.
These new reference designs integrate modem, transceivers, and RF front-end in a single and compact board, allowing manufacturers to quickly and cost-effectively include the capabilities of the novel Snapdragon Modem-RF Systems into new products, driving 5G adoption into a wide spectrum of devices. Snapdragon X75 and X72 5G Reference Designs support both sub-6 and mmWave bands, while Snapdragon X35 5G Reference Designs are the first to support 5G NR-Light (3GPP Release 17 RedCap).
Key features of the portfolio of reference designs include:
- These turnkey reference design solutions are optimized for performance and certified to work with 5G networks from all key mobile network operators globally. The Snapdragon X75, X72, and X35 5G Reference Designs are available in M.2 and LGA form factors.
- Providing design and certification support, OEMs, ODMs, and device manufacturers can develop global 5G module solutions with sub-6 and mmWave at a fraction of the cost available today by saving on engineering time, cost, and effort required to enable 5G connectivity using discrete cellular components.
- Enables OEMs, ODMs, and device manufacturers to leverage Qualcomm Technologies’ reference designs to accelerate end-product sampling and launch timelines while putting 5G in the hands of the consumer quicker.
Qualcomm and Dell Technologies to Accelerate 5G Open RAN Design and Deployments
- Companies aim to develop a virtualized distributed unit (vDU) solution to accelerate efficient, high-capacity deployments of next-generation 5G networks.
- Dell PowerEdge servers purpose-built for open telecom networks and the edge, combined with the Qualcomm X100 5G RAN Accelerator Card with commercial-grade Layer 1 (L1) software, aim to provide a high-performing, cost-effective and energy-efficient solution for OEMs and operators deploying virtualized and Open RAN solutions.
Qualcomm Technologies, Inc. announced plans to collaborate with Dell Technologies to develop a next-generation, 5G vDU, integrating the Qualcomm X100 5G RAN Accelerator Card into Dell PowerEdge servers. The solution will help usher in the next wave of digital transformation and proliferate Open RAN deployments globally. The companies plan to simplify deployments and help lower total cost of ownership by delivering high-performance, O-RAN compliant, energy-efficient, virtualized, cloud-native 5G solutions.
Schneider Electric and Capgemini Collaborate to Accelerate 5G Industrial Automation, Supported by Qualcomm
- The companies have customized an innovative end-to-end 5G Private Network solution with the potential of transforming industrial automation systems.
- Through highly advanced virtual connectivity, the system has the ability to be deployed across diverse industrial and logistics sites.
Schneider Electric, Capgemini, and Qualcomm Technologies, Inc. announced their collaboration on a first-of-its-kind 5G-enabled automated hoisting solution. The companies have joined efforts on design and installation of the solution at Schneider Electric’s hoisting lab in Grenoble, France. Replacing wired connections with wireless and unifying existing wireless connections from Schneider Electric’s industrial automation system, the 5G Private Network solution demonstrates how it can simplify and optimize digital technology deployment at scale across industrial sites — from steel plants to ports.
The 5G private network hoisting solution:
- Replaces wired and other wireless connections for several critical PLC control flows and time sensitive video flows powering numerous use cases
- Operates in 3.8GHz radio frequency band, with an enterprise-grade Athonet core network and Airspan Small Cells using the Qualcomm® FSM™100 5G RAN Platform, significantly improving connectivity performance and enabling new use cases
- Beyond its core industrial functions, the Private 5G automated hoisting system can now be leveraged to deliver additional digital use cases, such as augmented operators enabled by XR (eXtended Reality) and wearable devices.
Qualcomm Expands Offering to Simplify and Accelerate IoT Across Multiple Industries
- Drives innovation across edge devices and cloud by offering silicon and software services for functions commonly required for digital transformation such as location and condition monitoring
- Addresses the fragmented nature of digital transformation use-cases by enabling developers through API-first architectures and user-friendly tools with an ecosystem of hardware and software partners
- Expands the Company’s traditional hardware business model with the introduction of ongoing IoT services
- Qualcomm Aware will initially target real-time supply chain visibility and intelligence
- Qualcomm Technologies, Inc. today unveiled the Qualcomm Aware Platform, which empowers developers and enterprises to harness real-time information and data insights to accelerate their digital transformation programs.
The Qualcomm Aware advantage rests upon three key pillars: (1) technology leadership; (2) Enablement of an expansive ecosystem of hardware and software partners; and (3) an API-first architecture and developer-friendly tools that enable interoperability with partner clouds and leading enterprise software tools.
