Siemens Spotlight on Innovation

Siemens Spotlight on Innovation

I flew to Orlando May 22 as a guest of Siemens along with a select few other “influencers” to be introduced to a number of innovation projects fueled by Siemens technology. We met at the Dr. Phillips Center for Performing Arts in downtown Orlando (did you even know there was a downtown?), which itself is filled with Siemens equipment. There are few companies in the industrial area which I cover that have the vision and execution that Siemens is exhibiting right now.

By the way, there is a fantastic little taco place in downtown Orlando. Email or DM on Twitter, and I’ll share the name. Greg Hale of ISSSource.com and I had dinner there Wednesday. We agreed—among the best tacos we’ve had.

Barbara Humpton, CEO Siemens USA, led with an overview. Siemens has made a greater than $1B investment in R&D in the US with 7,000 engineers churning out 700 inventions per year.

She introduced former stunt man and motorcycle racer turned CEO Mike “Mouse” McCoy, CEO & Founder of HackRod. McCoy built on a foundation of Siemens PLM and SolidEdge CAD. He added a gaming engine. He was able to use VR for design reviews, interference checking, and simulation during the design process. We followed along with design and review of a new motorcycle. A few parts required somewhat exotic materials. Oak Ridge National Labs printed the parts from the design files downloaded from HackRod. The design teams were in Ventura, CA and Princeton, NJ with input from Munich, Germany. Collaboration was not a problem.

Beginning of design until component parts shipped to Orlando—2 weeks. The parts arrived Tuesday. McCoy and a partner assembled the motorcycle on Tuesday evening and wheeled (not drove) it onto the stage Wednesday about 1:30. Not bad? Heck, in my early career, we couldn’t have done a foam-core mock up in that time frame.

One thought McCoy left us with. “We need to talk STEAM, not just STEM—science, technology, engineering, arts, math.” It is now possible for artists and designers to be an intimate part of the team going from art to finished product quickly. 3D printing from PLM files. Way cool.

How about a high school mechanical design student given a project to provide a lighter prosthetic foot for an Army vet? Humpton introduced 18-year-old high school student Ashley Kimbel who had undertaken just such a project. She worked with the veteran to analyze his current “foot” looking for areas where weight could be eliminated. Then she had to learn how to fabricate and manufacture the device. We saw films of the veteran running with Ashley proving out the new prosthetic.

This is a long way from projects I had as a 17-year-old senior. Education and technology have come a long way in a lifetime. Oh, and her future? She wants to work in bioengineering designing and 3D printing organs. She will be working on that during her tenure at UAB. She is going to make a difference for many people.

I have many more ideas and conversations to capture. This will serve for now.
Check out #SiemensInnovates

Siemens Spotlight on Innovation

HPE Acquires Cray Consolidating Supercomputer Market

Today’s big enterprise IT news concerns Hewlett Packard Enterprise (HPE) and Cray entering into a definitive agreement under which HPE will acquire Cray for $35.00 per share in cash, in a transaction valued at approximately $1.3 billion, net of cash.

This is another example of technology industry consolidation. We’re seeing it with instrumentation, control, and automation companies. Enterprise IT is rapidly going that way. Both HPE and Dell Technologies have been scarfing up companies either matured and not growing or in need of capital to survive.

Signs of maturing industries mean one kind of shock waves for employment within them. But also this usually means preparing room in the market for new companies with disruptive new technologies and business models. It’s possible that we’re about to see a leap in quantum computing out of all this.

What does this mean for industrial users? We are seeing already companies like HPE moving their powerful compute platforms to the edge. With every advancement, we’ll see additional compute power bringing databases, analytics, AI, video and other applications to more remote installations.

Some additional details from the press release:

“Answers to some of society’s most pressing challenges are buried in massive amounts of data,” said Antonio Neri, President and CEO, HPE. “Only by processing and analyzing this data will we be able to unlock the answers to critical challenges across medicine, climate change, space and more. Cray is a global technology leader in supercomputing and shares our deep commitment to innovation. By combining our world-class teams and technology, we will have the opportunity to drive the next generation of high performance computing and play an important part in advancing the way people live and work.”

The Explosion of Data is Driving Strong HPC Growth

The explosion of data from artificial intelligence, machine learning, and big data analytics and evolving customer needs for data-intensive workloads are driving a significant expansion in HPC.

Over the next three years the HPC segment of the market and associated storage and services is expected to grow from approximately $28 billion in 2018 to approximately $35 billion in 2021, a compound annual growth rate of approximately 9 percent. Exascale is a growing segment of overall HPC opportunities and more than $4 billion of Exascale opportunities are expected to be awarded over the next five years.

“This is an amazing opportunity to bring together Cray’s leading-edge technology and HPE’s wide reach and deep product portfolio, providing customers of all sizes with integrated solutions and unique supercomputing technology to address the full spectrum of their data-intensive needs,” said Peter Ungaro, President and CEO of Cray. “HPE and Cray share a commitment to customer-centric innovation and a vision to create the global leader for the future of high performance computing and AI. On behalf of the Cray Board of Directors, we are pleased to have reached an agreement that we believe maximizes value and are excited for the opportunities that this unique combination will create for both our employees and our customers.”

High performance computing is a key component of HPE’s vision and growth strategy and the company currently offers world-class HPC solutions, including HPE Apollo and SGI, to customers worldwide. This portfolio will be further strengthened by leveraging Cray’s foundational technologies and adding complementary solutions. The combined company will also reach a broader set of end markets, offering enterprise, academic and government customers a broad range of solutions and deep expertise to solve their most complex problems. Together, HPE and Cray will have enhanced opportunities for growth and the integrated platform, scale and resources to lead the Exascale era of high performance computing.

Siemens Spotlight on Innovation

Survey Shows Humans Perform 72% of Manufacturing Tasks

My response to automation and robot dystopian writers is that for the most part these technologies have removed humans from dangerous and monotonous manufacturing work. Humans are freed to do things using their heads as well as their hands. This report from A.T. Kearney and Drishti further contradicts hype about accelerating factory automation; demonstrates the need for greater investment in the human workforce.

According to new data released today by A.T. Kearney and Drishti, humans still perform 72 percent of manufacturing tasks. This data, from a survey of more than 100 manufacturing leaders, suggests that despite headlines about robots and AI replacing humans in factories, people remain central to manufacturing, creating significantly more value on the factory floor than machines.

Respondents also noted that there’s an almost universal lack of data into the activities that people perform in the factory. This analytical gap severely limits manufacturers’ ability to make informed decisions on capacity planning, workforce management, process engineering and many other strategic domains. And it suggests that manufacturers may overprioritize automation due to an inability to quantify investments in the human workforce that would result in greater efficiencies.

“Despite the prominence of people on the factory floor, digital transformation strategies for even the most well-known, progressive manufacturers in the world remain largely focused on machines,” said Michael Hu, partner at A.T. Kearney. “This massive imbalance in the analytics footprint leaves manufacturers around the globe with a human-shaped blind spot, which prevents them from realizing the full potential of Industry 4.0.”

While manufacturing technology has seen increasing innovation for decades, the standard practices for gathering and analyzing tasks done by humans – and the foundation of holistic manufacturing practices like lean and Six Sigma – are time-and-motion study methodologies, which can be directly traced back to the time of Henry Ford and have not been updated for the digital age.

“The principles underlying these 100-year-old measurement techniques are still valid, but they are too manual to scale, return incomplete datasets and are subject to observation biases,” said Prasad Akella, founder and CEO of Drishti. “In the age of Industry 4.0, manufacturers need larger and more complete datasets from human activities to help empower operators to contribute value to their fullest potential. This data will benefit everyone in the assembly ecosystem: plant managers, supervisors, engineers and, most importantly, the operators themselves.”

Additionally, the survey respondents noted the significant overhead needed for traditional data gathering methodologies: on average, 37 percent of skilled engineers’ time is spent gathering analytics data manually.

“Humans are the most valuable asset in the factory, and manufacturers should leverage new technology to extend the capabilities of both direct and indirect labor,” said Akella. “If you could give your senior engineers more than a third of their time back, you’d see immediate gains. Instead of spending so many hours collecting data, their attention and capabilities would remain focused on the most critical decisions and tasks.”

The survey also revealed the flip side of human contributions to manufacturing systems: Survey respondents noted that 73 percent of variability on the factory floor stems from humans, and 68 percent of defects are caused by human activities. Perhaps as a result, 39 percent of engineering time is spent on root cause investigations to trace defects – another manual expenditure of time that could be greatly reduced with better data.

“The bottom line is that better data can help both manufacturers and human operators across the board,” said Hu. “Data illuminates opportunities for productivity and quality improvements; simplifies traceability; mitigates variability; and creates new opportunities for operators to add even greater value. Humans are going to be the backbone of manufacturing for the foreseeable future, and the companies that improve their human factory analytics are the ones that will be best positioned to compete in Industry 4.0.”

To view the full report, click.

A.T. Kearney is a leading global management consulting firm with offices in more than 40 countries.

Siemens Spotlight on Innovation

Advantech Quietly an Internet of Things Leader

Advantech has been appearing on a variety of lists of prominent Internet of Things suppliers. The Taiwanese computer company with a US office in Cincinnati, OH and intellectual leadership, supplies intelligent I/O, a variety of computing devices, and HMI devices.

Several years ago I was privileged to be invited to Suzhou, China to attend Advantech’s user conference. It was an impressive event. This year they called it the “first IoT Co-Creation Summit.”

More than five thousand Advantech clients and partners from around the world attended the summit. Here Advantech introduced its newest IoT platform structure WISE-PaaS 3.0 and 32 IoT solution ready packages (SRPs) co-created with software and industry partners.

The event in itself will aid in the software/hardware integration for various industries, connect and build a complete industrial IoT ecosystem and value chain, and allow Advantech and partners to officially step into the next IoT stage.

Advantech Chairman KC Liu stated that in view of IoT application characteristic’s diversity and fragmented market, Advantech has assisted industries in integrating and connecting existing hardware and software and regards creating a complete industry value chain as its primary task in IoT industry development.

Advantech is introducing new features for its WISE-PaaS 3.0 and sharing a number of IoT solution ready packages (SRPs), based on WISE-PaaS, developed with numerous co-creation partners. The company is also outlining future co-creation strategies and schedules for the upcoming year.

Allan Yang, Chief Technology Officer at Advantech said, “While IoT is currently flourishing and many companies have invested in connectivity and data collection equipment, we are still in the early stages of generating value from IoT data. Since WISE-PaaS launched in 2014, Advantech has continued its integration and improved connectivity with open source communities. Our IoT software modules are developed to create operational cloud platform services oriented around the commercial value generated by data acquisition. Data-driven innovation has thus become the main target for our WISE-PaaS evolution.

WISE-PaaS 3.0 offers four main function modules:

  • WISE-PaaS/SaaS Composer: a cloud configuration tool with visible workflow. WISE-PaaS/SaaS Composer supports customized component plotting for simple and intuitive 3D modeling application and interaction. It updates views at millisecond rates and, together with WISE-PaaS/Dashboard, presents critical management data in a visually intuitive display to help extract valuable data and improve operational efficiency.
  • WISE-PaaS/AFS (AI Framework Service): an artificial intelligence training model and deployment service framework. The WISE-PaaS/AFS provides a simple drag and drop interface that allows developers to quickly input industrial data. When combined with AI algorithms, the service builds an effective inference engine with automatic deployment to edge computing platforms. AFS offers model accuracy management, model retraining, and automated redeployment. It simultaneously controls multiple AI models in the application field; offering automated model accuracy improvements and life-cycle management services.
  • WISE-PaaS/APM (Asset Performance Management): an equipment network connection remote maintenance service framework. WISE-PaaS/APM connects to a wide array of on-site industrial equipment controls and communication protocols. It supports the latest edge computing open standard, EdgeX Foundry, and includes built-in equipment management and workflow integration templates. Jointly with the AFS, APM accelerates Machine to Intelligence (M2I) application development.
  • Microservice development framework: WISE-PaaS contains a micro service development framework to help developers rapidly create program design frameworks while reducing development requisites. Micro service functions, such as service finding, load balancing, service administration, and configuration center, all offer built-in flexible support mechanisms.

Advantech recently established a water treatment system, jointly developed with GSD (China) Co., Ltd., and a CNC equipment remote operation service, jointly developed with Yeong Chin Machinery Industries Co. Ltd. Both partnerships demonstrate how industrial digital transformations, led by Advantech and its partners through the co-creation model, offer innovative win-win IoT solutions.

Advantech’s IIoT iAutomation Group has launched a broad selection of rackmount GPU Servers from 1U to 4U. The SKY-6000 GPU server series are powered by Intel Xeon scalable processors and each of these highly scalable GPU-optimized servers support up to five NVIDIA Tesla P4 GPUs. IPMI management functions and smart fan control ensure better temperature control and thermal management environments. Every GPU pair includes one high-speed PCIe slot for highly parallel applications like artificial intelligence (AI), deep learning, self-driving cars, smart city applications, health care, high performance computing, virtual reality, and much more.

AI Deep Learning GPU Solution

With support for up to five pcs of half-length half-height (HHHL) GPU cards or one full-height full-length (FHFL) double deck card, plus one full-height half-length (FHHL) GPU card, the SKY-6100 series are designed for NVidia Tesla P4 HHHL GPU cards, making it the best choice for deep learning applications.

IPMI Server Management

With IPMI 2.0 support, the SKY-6000 series allows users to monitor, manage, and control servers remotely and receive alerts if any sensors detect device or component faults. In addition, event logs record important information about the server which can be controlled remotely using the IPMI KVM.

Smart Fan Control

The optimized thermal design separates the CPU and GPU fan zones, making sure the GPU card is not preheated or thermally affected by any other heat source. Also, with the smart fan control mechanism, fan speeds are controlled based on different CPU and GPU workloads and ambient temperature. This feature lowers the acoustic noise of GPUs that have heavy loading but not CPUs. Advantech’s SKY-6000 server series are available for order now.

Siemens Spotlight on Innovation

FDT IIoT Server Standard to Empower Platform Independent Deployment

Another group validates standards for industrial communication including FDT and OPC UA.

FDT Group, an independent, international, not-for-profit standards association supporting the evolution of FDT technology (IEC 62453), announced that its Board of Directors voted unanimously to empower the emerging FDT IIoT Server (FITS) architecture with full platform independence. This decision strengthens the FITS architecture to support the diverse array of operating systems to meet industry-driven demands.

In addition to platform independence, key features of the FITS solution include native integration of the OPC Unified Architecture (OPC UA), as well as comprehensive Control and Web Services interfaces. With built-in security protecting valuable information and operating data, the FITS platform will enable cloud, enterprise, on-premise, and a single-user desktop deployment method meeting the needs of the process, hybrid and discrete manufacturing sectors.

“The FITS platform is the ‘game changer’ the automation industry has been anticipating,” said Glenn Schulz, managing director of FDT Group. “I’d like to thank our Architecture and Specification Working Group that worked behind the scenes investigating and prototyping the platform independence feature approved by our board.”

Schulz added, “The Architecture and Specification Working Group has been directed to immediately transition FDT Server Common Components to a pure .NET Core implementation, previously built on the Microsoft .NET Framework. This transition will result in a single FDT Server environment deployable on a Microsoft-, Linux-, or macOS-based operating system, which will empower the intelligent enterprise by bridging the current installed base with next-generation solutions supporting the IIoT and I4.0 era.”

The significant decision and direction allows nearly unlimited deployment and application scenarios. For example, cloud-based FDT Servers can enjoy the performance and cost benefits of a Linux operating system. Traditional control system vendors can offer the FDT Server embedded in their hardware, and machine builders can deploy a small Linux-based FDT Server offering a comprehensive preconfigured asset management system for their skid that can be securely accessed remotely or with smart phones or browsers.

MES applications can also incorporate an FDT Server to gain secure, direct access to production data and asset health and availability metrics through OPC UA. In addition, service providers can wrap services around an FDT Server delivered in an industrial hardened Linux box. The opportunities for cost savings and value creation goes on due to the highly flexible deployment options of the FITS standard.

Because of the security, scalability and the ease of deployment of an FDT Server, the solution will simplify entry into the IIoT marketplace as the only open platform standardized integration architecture providing a single interface with cloud-to-plant floor mobile access. The decision to migrate to platform independence will delay the launch of the FITS specification by approximately six months. With the launch planned for the latter half of 2019, alongside Common Components supporting the FITS standard, automation suppliers and service providers will immediately reap the benefits of a quick development and deployment strategy. Common Components create a library of FDT routines and will simplify compliant development of FITS-based solutions such as Servers, Device Type Managers (DTMs) and APPs.

The final standard will be delivered as three documents: the FDT 2.5 specification, which builds on FDT 2.1 to include HTML5 and JavaScript graphical user interface features; the FITS Web Services Technical Specification, which describes the Web Services interfaces and requirements for an FDT Server; and the OPC UA Annex detailing the OPC UA Server mapping for an FDT Server.

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